F4BTMS233 DK2.33 3.5mil substrate core PCB ENIG Finish Ceramic-Filled PTFE Laminate and Ultra-Thin PCB Solutions for Microwave, RF

製品の説明

When an aerospace RF design demands both low dielectric constant and ultra-thin construction, material options narrow quickly. The F4BTMS233 from Taizhou Wangling Insulation Materials Factory addresses this niche directly: an aerospace-grade, ceramic-filled PTFE laminate with a Dk of 2.33, available in dielectric thicknesses as thin as 0.09mm (3.5 mil), and engineered to replace comparable foreign products. The F4BTMS series is an upgraded version of the F4BTM series,