10層多層ハイブリッドRO4350B+Tg170 TU-768 FR4 RF/マイクロ波基板、レジン充填およびメッキフラットビア付き
担当者 : Sally Mao
電話番号 : 86-755-27374847
ワットスアップ : +8618277967574
製品の説明
This article presents the design rationale for a 4-layer hybrid dielectric PCB that combines the superior high-frequency performance of Rogers RO4003C™ with the cost-effectiveness and thermal reliability of Tg170 FR4 prepreg. This hybrid construction is engineered for RF/microwave applications requiring controlled impedance, low signal attenuation, and reliable thermal performance in a compact, thin form factor. By utilizing RO4003C as the RF signal layer and Tg170 FR4
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