|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish
Product Introduction
We present our 2-Layer RT/duroid 6002 PCB – a premium high-frequency circuit board engineered for demanding microwave and RF applications. Fabricated with Rogers RT/duroid 6002 ceramic-filled PTFE laminate and finished with Immersion Silver, this 0.8mm (30mil) board delivers ultra-low loss (Df 0.0012 @ 10 GHz), exceptional dielectric constant stability (Dk 2.94 ±0.04), and outstanding dimensional stability. The absence of solder mask and silkscreen, combined with the Immersion Silver finish, provides a pure, low-loss RF path ideal for phased array antennas, radar systems, and space-grade electronics.
Key Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 6002 (Ceramic-filled PTFE) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.8 mm (30 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 6 / 7 mils |
| Min Hole Size | 0.3 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Solder Mask | None (Top & Bottom) |
| Silkscreen | None (Top & Bottom) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | Rogers RT/duroid 6002 | 0.762 mm (30 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.
PCB Statistics
Dimensions: 156 mm × 87.9 mm (1 piece)
Components: 94
Total Pads: 241 (196 thru-hole, 45 SMT on top, 0 on bottom)
Vias: 126
Nets: 2 (Simple, high-performance RF signal paths)
Why RT/duroid 6002?
RT/duroid 6002 is a ceramic-filled PTFE composite engineered for complex microwave structures requiring a low dielectric constant and ultra-low loss. Unlike standard RF laminates, it offers a remarkably low thermal coefficient of Dk (12 ppm/°C), ensuring stable performance across wide temperature swings. With a decomposition temperature (Td) of 500°C and low out-gassing characteristics, it is ideally suited for space applications and other mission-critical environments.
Key Features of RT/duroid 6002
| Parameter | Value |
| Dielectric Constant (Dk) | 2.94 ±0.04 @ 10 GHz |
| Thermal Coefficient of Dk | 12 ppm/°C |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz |
| Td (Decomposition Temp.) | 500°C (TGA) |
| Thermal Conductivity | 0.6 W/m/K |
| CTE – Z axis | 24 ppm/°C |
| Moisture Absorption | 0.02% (ultra-low) |
Benefits of This RT/duroid 6002 PCB
Ultra-Low Loss: Df of 0.0012 at 10 GHz minimizes insertion loss – ideal for long RF traces and high-sensitivity receivers.
Tight Dk Control: ±0.04 tolerance ensures predictable impedance and phase matching for phased array and beamforming networks.
Temperature Stable: Low thermal coefficient of Dk (12 ppm/°C) maintains consistent performance across operating temperature ranges.
Copper-Matched CTE: In-plane expansion coefficient matched to copper – excellent dimensional stability for temperature-sensitive applications.
Low Out-Gassing: Ideal for space applications, satellite communications, and vacuum environments.
Immersion Silver Finish: Provides a flat, solderable, low-loss surface with excellent conductivity and RF transparency. No solder mask or silkscreen eliminates dielectric interference on RF traces.
Multi-Layer Ready: Excellent mechanical and electrical properties support reliable multi-layer board constructions.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Typical Applications
Phased Array Antennas (military, commercial, 5G)
Ground-Based & Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes (high-frequency, low-loss)
Commercial Airline Collision Avoidance Systems (TCAS)
Beam Forming Networks
Satellite Communication Payloads
Space-Grade RF Electronics
Ordering Information
Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.
Contact us for:
Impedance control reports
Phase matching verification
Out-gassing test data (for space applications)
Volume pricing and lead times
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish
Product Introduction
We present our 2-Layer RT/duroid 6002 PCB – a premium high-frequency circuit board engineered for demanding microwave and RF applications. Fabricated with Rogers RT/duroid 6002 ceramic-filled PTFE laminate and finished with Immersion Silver, this 0.8mm (30mil) board delivers ultra-low loss (Df 0.0012 @ 10 GHz), exceptional dielectric constant stability (Dk 2.94 ±0.04), and outstanding dimensional stability. The absence of solder mask and silkscreen, combined with the Immersion Silver finish, provides a pure, low-loss RF path ideal for phased array antennas, radar systems, and space-grade electronics.
Key Specifications
| Parameter | Details |
| Base Material | Rogers RT/duroid 6002 (Ceramic-filled PTFE) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.8 mm (30 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 6 / 7 mils |
| Min Hole Size | 0.3 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Solder Mask | None (Top & Bottom) |
| Silkscreen | None (Top & Bottom) |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | Rogers RT/duroid 6002 | 0.762 mm (30 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.
PCB Statistics
Dimensions: 156 mm × 87.9 mm (1 piece)
Components: 94
Total Pads: 241 (196 thru-hole, 45 SMT on top, 0 on bottom)
Vias: 126
Nets: 2 (Simple, high-performance RF signal paths)
Why RT/duroid 6002?
RT/duroid 6002 is a ceramic-filled PTFE composite engineered for complex microwave structures requiring a low dielectric constant and ultra-low loss. Unlike standard RF laminates, it offers a remarkably low thermal coefficient of Dk (12 ppm/°C), ensuring stable performance across wide temperature swings. With a decomposition temperature (Td) of 500°C and low out-gassing characteristics, it is ideally suited for space applications and other mission-critical environments.
Key Features of RT/duroid 6002
| Parameter | Value |
| Dielectric Constant (Dk) | 2.94 ±0.04 @ 10 GHz |
| Thermal Coefficient of Dk | 12 ppm/°C |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz |
| Td (Decomposition Temp.) | 500°C (TGA) |
| Thermal Conductivity | 0.6 W/m/K |
| CTE – Z axis | 24 ppm/°C |
| Moisture Absorption | 0.02% (ultra-low) |
Benefits of This RT/duroid 6002 PCB
Ultra-Low Loss: Df of 0.0012 at 10 GHz minimizes insertion loss – ideal for long RF traces and high-sensitivity receivers.
Tight Dk Control: ±0.04 tolerance ensures predictable impedance and phase matching for phased array and beamforming networks.
Temperature Stable: Low thermal coefficient of Dk (12 ppm/°C) maintains consistent performance across operating temperature ranges.
Copper-Matched CTE: In-plane expansion coefficient matched to copper – excellent dimensional stability for temperature-sensitive applications.
Low Out-Gassing: Ideal for space applications, satellite communications, and vacuum environments.
Immersion Silver Finish: Provides a flat, solderable, low-loss surface with excellent conductivity and RF transparency. No solder mask or silkscreen eliminates dielectric interference on RF traces.
Multi-Layer Ready: Excellent mechanical and electrical properties support reliable multi-layer board constructions.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Typical Applications
Phased Array Antennas (military, commercial, 5G)
Ground-Based & Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes (high-frequency, low-loss)
Commercial Airline Collision Avoidance Systems (TCAS)
Beam Forming Networks
Satellite Communication Payloads
Space-Grade RF Electronics
Ordering Information
Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.
Contact us for:
Impedance control reports
Phase matching verification
Out-gassing test data (for space applications)
Volume pricing and lead times
