|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
4-Layer Hybrid High-Frequency PCB – WL-CT330 + FR4 (Immersion Gold)
Product Introduction
We present our 4-Layer WL-CT330 PCB with Immersion Gold – a hybrid solution engineered for high-frequency, high-reliability applications. The design combines a WL-CT330 high-frequency laminate (top two layers) with a High-Tg FR-4 (S1000-2M) substrate (bottom layers). This hybrid stackup delivers ultra-low loss RF performance on the outer layers while maintaining mechanical rigidity and cost-efficiency for the overall board. The 2.7mm finished thickness and 1oz copper on all layers ensure excellent power handling and thermal management.
Key Specifications
| Parameter | Details |
| Base Material | WL-CT330 (Top RF section) + High-Tg FR-4 S1000-2M |
| Layer Count | 4 Layers (Rigid) |
| Finished Thickness | 2.7 mm ±0.15 mm |
| Copper Weight | 1 oz (35μm) on all inner/outer layers |
| Min Trace/Space | 5/6 mils |
| Min Hole Size | 0.25 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Top & Bottom: Green |
| Silkscreen | Top: Black / Bottom: None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (4-Layer Rigid Hybrid)
| Layer | Material | Thickness |
| Layer 1 (Top RF) | 1 oz Copper (35μm) | – |
| Substrate 1 | WL-CT330 (High-frequency laminate) | 1.524 mm (60 mil) |
| Layer 2 (Inner RF) | 1 oz Copper (35μm) | – |
| Prepreg | 1080 RC63% + 7628 (43%) | 0.254 mm (10 mil) |
| Layer 3 (Inner FR4) | 1 oz Copper (35μm) | – |
| Substrate 2 | S1000-2M (High-Tg FR-4) | 0.8 mm (31.5 mil) |
| Layer 4 (Bottom FR4) | 1 oz Copper (35μm) | – |
Note: No blind vias – all interconnections are through-hole vias, simplifying manufacturing and reducing cost.
PCB Statistics
Dimensions: 165 mm × 96.5 mm (1 piece)
Components: 45
Total Pads: 225 (126 thru-hole, 59 SMT top, 40 SMT bottom)
Vias: 63 (No blind vias)
Nets: 9
Why WL-CT330?
WL-CT330 is a thermosetting hydrocarbon/ceramic composite with fiberglass reinforcement. Unlike PTFE-based materials, it processes like standard FR4 (no special handling), supports lead-free assembly at 260°C, and offers a high Tg >280°C for exceptional thermal reliability. With a stable Dk of 3.30 ±0.06 and Df of 0.0026 at 10 GHz, it delivers consistent RF performance across temperature and frequency.
Key Features of WL-CT330
Dielectric Constant (Dk): 3.30 ±0.06 @ 10 GHz
Dissipation Factor (Df): 0.0026 @ 10 GHz
Tg: >280°C
Thermal Conductivity: 0.59 W/m·K
Thermal Resistance: T260 >60 min, T288 >20 min
Peel Strength (1oz ED copper): ≥0.85 N/mm
CTE (X/Y/Z): 15 / 13 / 39 ppm/°C
Moisture Absorption: ≤0.05%
Flammability Rating: UL 94-V0
Volume/Surface Resistivity: 5×10⁹ Mohm·cm / Mohm
Stable TcDk (temperature coefficient of Dk)
Benefits of This Hybrid Design
Cost-Effective: Only the RF-critical layers use high-frequency WL-CT330; the rest uses standard high-Tg FR4.
Process-Friendly: No PTFE-specific handling – compatible with standard FR4 fabrication and lead-free assembly.
Thermally Reliable: High Tg (>280°C) and low Z-axis CTE reduce risk of via cracking during reflow.
Signal Integrity: Ultra-low Df (0.0026) minimizes insertion loss for high-speed digital and RF traces.
Immersion Gold Finish: Provides a flat, solderable, corrosion-resistant surface for fine-pitch SMT components.
Typical Applications
5G/6G Infrastructure: Base stations, phased array antennas
Automotive Radar: ADAS, V2X communication modules
Satellite Communications: Navigation, ground terminals
Aerospace & Defense: Early warning radar, airborne systems
RF Power Amplifiers & Transceivers
High-Speed Backplanes: Servers, networking switches, data center equipment
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Ordering Information
Submit your Gerber files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for lead times and pricing based on your annual consumption.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
4-Layer Hybrid High-Frequency PCB – WL-CT330 + FR4 (Immersion Gold)
Product Introduction
We present our 4-Layer WL-CT330 PCB with Immersion Gold – a hybrid solution engineered for high-frequency, high-reliability applications. The design combines a WL-CT330 high-frequency laminate (top two layers) with a High-Tg FR-4 (S1000-2M) substrate (bottom layers). This hybrid stackup delivers ultra-low loss RF performance on the outer layers while maintaining mechanical rigidity and cost-efficiency for the overall board. The 2.7mm finished thickness and 1oz copper on all layers ensure excellent power handling and thermal management.
Key Specifications
| Parameter | Details |
| Base Material | WL-CT330 (Top RF section) + High-Tg FR-4 S1000-2M |
| Layer Count | 4 Layers (Rigid) |
| Finished Thickness | 2.7 mm ±0.15 mm |
| Copper Weight | 1 oz (35μm) on all inner/outer layers |
| Min Trace/Space | 5/6 mils |
| Min Hole Size | 0.25 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Top & Bottom: Green |
| Silkscreen | Top: Black / Bottom: None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (4-Layer Rigid Hybrid)
| Layer | Material | Thickness |
| Layer 1 (Top RF) | 1 oz Copper (35μm) | – |
| Substrate 1 | WL-CT330 (High-frequency laminate) | 1.524 mm (60 mil) |
| Layer 2 (Inner RF) | 1 oz Copper (35μm) | – |
| Prepreg | 1080 RC63% + 7628 (43%) | 0.254 mm (10 mil) |
| Layer 3 (Inner FR4) | 1 oz Copper (35μm) | – |
| Substrate 2 | S1000-2M (High-Tg FR-4) | 0.8 mm (31.5 mil) |
| Layer 4 (Bottom FR4) | 1 oz Copper (35μm) | – |
Note: No blind vias – all interconnections are through-hole vias, simplifying manufacturing and reducing cost.
PCB Statistics
Dimensions: 165 mm × 96.5 mm (1 piece)
Components: 45
Total Pads: 225 (126 thru-hole, 59 SMT top, 40 SMT bottom)
Vias: 63 (No blind vias)
Nets: 9
Why WL-CT330?
WL-CT330 is a thermosetting hydrocarbon/ceramic composite with fiberglass reinforcement. Unlike PTFE-based materials, it processes like standard FR4 (no special handling), supports lead-free assembly at 260°C, and offers a high Tg >280°C for exceptional thermal reliability. With a stable Dk of 3.30 ±0.06 and Df of 0.0026 at 10 GHz, it delivers consistent RF performance across temperature and frequency.
Key Features of WL-CT330
Dielectric Constant (Dk): 3.30 ±0.06 @ 10 GHz
Dissipation Factor (Df): 0.0026 @ 10 GHz
Tg: >280°C
Thermal Conductivity: 0.59 W/m·K
Thermal Resistance: T260 >60 min, T288 >20 min
Peel Strength (1oz ED copper): ≥0.85 N/mm
CTE (X/Y/Z): 15 / 13 / 39 ppm/°C
Moisture Absorption: ≤0.05%
Flammability Rating: UL 94-V0
Volume/Surface Resistivity: 5×10⁹ Mohm·cm / Mohm
Stable TcDk (temperature coefficient of Dk)
Benefits of This Hybrid Design
Cost-Effective: Only the RF-critical layers use high-frequency WL-CT330; the rest uses standard high-Tg FR4.
Process-Friendly: No PTFE-specific handling – compatible with standard FR4 fabrication and lead-free assembly.
Thermally Reliable: High Tg (>280°C) and low Z-axis CTE reduce risk of via cracking during reflow.
Signal Integrity: Ultra-low Df (0.0026) minimizes insertion loss for high-speed digital and RF traces.
Immersion Gold Finish: Provides a flat, solderable, corrosion-resistant surface for fine-pitch SMT components.
Typical Applications
5G/6G Infrastructure: Base stations, phased array antennas
Automotive Radar: ADAS, V2X communication modules
Satellite Communications: Navigation, ground terminals
Aerospace & Defense: Early warning radar, airborne systems
RF Power Amplifiers & Transceivers
High-Speed Backplanes: Servers, networking switches, data center equipment
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance
ISO 9001 certified production
Ordering Information
Submit your Gerber files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for lead times and pricing based on your annual consumption.
