|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
2-Layer RF-30A High-Frequency PCB – 20mil (0.6mm) with ENIG Finish
Product Introduction
We present our 2-Layer RF-30A PCB – a high-performance, thin-profile circuit board engineered for demanding RF and microwave applications. Fabricated with RF-30A laminate (Dk 3.0, Df 0.003 @ 10 GHz) and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.6mm (20mil) board delivers excellent signal integrity, low insertion loss, and superior environmental stability. The thin dielectric profile minimizes parasitic effects, making it ideal for compact, high-frequency wireless and radar systems.
Key Specifications
| Parameter | Details |
| Base Material | RF-30A (High-performance RF-grade laminate) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.6 mm (20 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 4 / 6 mils |
| Min Hole Size | 0.25 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Top: Green / Bottom: None |
| Silkscreen | Top: White / Bottom: None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | RF-30A Laminate | 0.508 mm (20 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole, simplifying fabrication and reducing cost.
PCB Statistics
Dimensions: 85.6 mm × 99.8 mm (1 piece)
Components: 54
Total Pads: 43 (19 thru-hole, 24 SMT on top, 0 on bottom)
Vias: 36
Nets: 2 (Simple, high-speed RF signal paths)
Why RF-30A?
RF-30A is a next-generation RF laminate featuring an advanced resin system and optimized glass fabric reinforcement. Unlike conventional PTFE-based materials, RF-30A processes like standard FR4 – no special handling required – while delivering exceptional high-frequency performance. With a Tg >180°C, it fully supports 260°C lead-free assembly and offers outstanding thermal and chemical resistance for harsh operating environments.
Key Features of RF-30A
| Parameter | Value |
| Dielectric Constant (Dk) | 3.0 @ 10 GHz |
| Dissipation Factor (Df) | 0.003 @ 10 GHz |
| Tg (Glass Transition Temp.) | >180°C |
| Thermal Resistance (T260) | >90 minutes |
| Thermal Resistance (T288) | >30 minutes |
| Peel Strength (1 oz ED copper) | ≥9 lbs/inch |
| CTE – X axis | 9–11 ppm/°C |
| CTE – Y axis | 11–13 ppm/°C |
| CTE – Z axis | 38 ppm/°C |
| Moisture Absorption | 0.08% (ultra-low) |
| Thermal Conductivity | High (efficient heat dissipation) |
| Flammability Rating | UL 94-V0 |
| CAF Resistance | Excellent |
| Chemical Resistance | Excellent |
Benefits of This 20mil RF-30A PCB
Ultra-Low Loss: Df of 0.003 at 10 GHz minimizes signal attenuation for long RF traces.
Stable Dk: Consistent dielectric constant across frequency and temperature ensures predictable impedance control.
Thin Profile (20mil): Reduces parasitic capacitance and inductance, ideal for compact RF modules and portable devices.
Lead-Free Assembly Ready: Withstands 260°C reflow (T260 >90 min, T288 >30 min).
CTE Matched to Copper: X/Y CTE (9–13 ppm/°C) closely matches copper, reducing stress on plated vias and improving solder joint reliability.
ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top SMT pads).
Process-Friendly: No PTFE-specific handling – compatible with standard FR4 fabrication lines, reducing lead times and cost.
Reliable in Harsh Environments: Ultra-low moisture absorption (0.08%) and excellent CAF/chemical resistance ensure long-term field performance.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance (artwork supplied)
ISO 9001 certified production
Typical Applications
RF/Microwave Communication Devices
5G/6G Base Stations & Antennas
Radar Systems (automotive, defense, weather)
Satellite Communication Equipment
RF Power Amplifiers & Transceivers
Aerospace & Defense Electronics
High-Frequency Test Instruments
Automotive RF Components (V2X, radar, telematics)
Ordering Information
Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for lead times, impedance control reports, and volume pricing.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
2-Layer RF-30A High-Frequency PCB – 20mil (0.6mm) with ENIG Finish
Product Introduction
We present our 2-Layer RF-30A PCB – a high-performance, thin-profile circuit board engineered for demanding RF and microwave applications. Fabricated with RF-30A laminate (Dk 3.0, Df 0.003 @ 10 GHz) and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.6mm (20mil) board delivers excellent signal integrity, low insertion loss, and superior environmental stability. The thin dielectric profile minimizes parasitic effects, making it ideal for compact, high-frequency wireless and radar systems.
Key Specifications
| Parameter | Details |
| Base Material | RF-30A (High-performance RF-grade laminate) |
| Layer Count | 2 Layers (Double-sided) |
| Finished Thickness | 0.6 mm (20 mil) |
| Copper Weight | 1 oz (35 μm) on both outer layers |
| Min Trace/Space | 4 / 6 mils |
| Min Hole Size | 0.25 mm (Mechanical drilling) |
| Via Plating Thickness | 20 μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Top: Green / Bottom: None |
| Silkscreen | Top: White / Bottom: None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stackup (2-Layer Rigid)
| Layer | Material | Thickness |
| Top Copper | 1 oz (35 μm) | – |
| Substrate | RF-30A Laminate | 0.508 mm (20 mil) |
| Bottom Copper | 1 oz (35 μm) | – |
Note: No blind vias – all interconnections are through-hole, simplifying fabrication and reducing cost.
PCB Statistics
Dimensions: 85.6 mm × 99.8 mm (1 piece)
Components: 54
Total Pads: 43 (19 thru-hole, 24 SMT on top, 0 on bottom)
Vias: 36
Nets: 2 (Simple, high-speed RF signal paths)
Why RF-30A?
RF-30A is a next-generation RF laminate featuring an advanced resin system and optimized glass fabric reinforcement. Unlike conventional PTFE-based materials, RF-30A processes like standard FR4 – no special handling required – while delivering exceptional high-frequency performance. With a Tg >180°C, it fully supports 260°C lead-free assembly and offers outstanding thermal and chemical resistance for harsh operating environments.
Key Features of RF-30A
| Parameter | Value |
| Dielectric Constant (Dk) | 3.0 @ 10 GHz |
| Dissipation Factor (Df) | 0.003 @ 10 GHz |
| Tg (Glass Transition Temp.) | >180°C |
| Thermal Resistance (T260) | >90 minutes |
| Thermal Resistance (T288) | >30 minutes |
| Peel Strength (1 oz ED copper) | ≥9 lbs/inch |
| CTE – X axis | 9–11 ppm/°C |
| CTE – Y axis | 11–13 ppm/°C |
| CTE – Z axis | 38 ppm/°C |
| Moisture Absorption | 0.08% (ultra-low) |
| Thermal Conductivity | High (efficient heat dissipation) |
| Flammability Rating | UL 94-V0 |
| CAF Resistance | Excellent |
| Chemical Resistance | Excellent |
Benefits of This 20mil RF-30A PCB
Ultra-Low Loss: Df of 0.003 at 10 GHz minimizes signal attenuation for long RF traces.
Stable Dk: Consistent dielectric constant across frequency and temperature ensures predictable impedance control.
Thin Profile (20mil): Reduces parasitic capacitance and inductance, ideal for compact RF modules and portable devices.
Lead-Free Assembly Ready: Withstands 260°C reflow (T260 >90 min, T288 >30 min).
CTE Matched to Copper: X/Y CTE (9–13 ppm/°C) closely matches copper, reducing stress on plated vias and improving solder joint reliability.
ENIG Finish: Provides a flat, solderable, oxidation-resistant surface for fine-pitch SMT components (24 top SMT pads).
Process-Friendly: No PTFE-specific handling – compatible with standard FR4 fabrication lines, reducing lead times and cost.
Reliable in Harsh Environments: Ultra-low moisture absorption (0.08%) and excellent CAF/chemical resistance ensure long-term field performance.
Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 compliance
Full Gerber RS-274-X acceptance (artwork supplied)
ISO 9001 certified production
Typical Applications
RF/Microwave Communication Devices
5G/6G Base Stations & Antennas
Radar Systems (automotive, defense, weather)
Satellite Communication Equipment
RF Power Amplifiers & Transceivers
Aerospace & Defense Electronics
High-Frequency Test Instruments
Automotive RF Components (V2X, radar, telematics)
Ordering Information
Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping. Contact us for lead times, impedance control reports, and volume pricing.
