|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2〜10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
IsoClad® 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs
We are pleased to introduce the IsoClad® 933, a premium high-frequency laminate engineered to deliver an exceptional balance of mechanical flexibility, electrical performance, and isotropic stability. Part of Rogers Corporation's renowned IsoClad series, this material utilizes a unique nonwoven fiberglass reinforcement within a PTFE matrix, setting it apart from traditional woven glass substrates and making it an ideal solution for advanced, conformal RF applications.
Engineered for Flexibility and Isotropic Consistency
The core innovation of IsoClad 933 lies in its nonwoven fiberglass structure. This design yields a material that is significantly less rigid than standard woven fiberglass laminates, providing the flexibility required for conformal antennas and curved electronic assemblies. Crucially, the random orientation of the fibers results in highly isotropic properties in the X, Y, and Z directions. This means the material behaves uniformly regardless of direction, leading to more predictable electrical performance, reduced risk of warpage, and simplified modeling for complex circuit designs—a critical advantage for stripline and microstrip circuits.
| Typical Properties: IsoClad | ||||
| Property | Test Method | Condition | IsoClad 917 | IsoClad 933 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 | 2.33 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0013 | 0.0016 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted | -10°C to +140°C | -157 | -132 |
| c | IPC TM-650 2.4.8 | After Thermal | 10 | 10 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.5 x 10 10 | 3.5 x 10 8 |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.0 x 10 9 | 1.0 x 10 8 |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 133, 120 | 173, 147 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 4.3, 3.8 | 6.8, 5.3 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 182 | 197 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 213 | 239 |
| Dielectric Breakdown (kv) | ASTM D-149 | D48/50 | >45 | >45 |
| Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 | 2.27 |
| Water Absorption (%) | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.04 | 0.05 |
| Coefficient of Thermal | IPC TM-650 2.4.24 Mettler 3000 | 0°C to 100°C | ||
| Expansion (ppm/°C) | Thermomechanical Analyzer | |||
| X Axis | 46 | 31 | ||
| Y Axis | 47 | 35 | ||
| Z Axis | 236 | 203 | ||
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.263 | 0.263 |
| Outgassing | ||||
| Total Mass Loss (%) | Maximum 1.00% | 125°C, ≤10-6 torr | 0.02 | 0.03 |
| Collected Volatile | Maximum 0.10% | 0 | 0 | |
| Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 | 0.02 | ||
| NO | NO | |||
| Flammability | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets | Meets |
| requirements of UL94-V0 | requirements of UL94-V0 | |||
Reliable Electrical Performance for Demanding Systems
IsoClad 933 offers dependable electrical characteristics tailored for high-frequency operation. It features a stable dielectric constant (Dk) of 2.33 at 10 GHz and a low dissipation factor (Df) of 0.0016. This combination ensures controlled impedance and minimal signal loss, making it suitable for a wide range of RF applications. The laminate demonstrates a low thermal coefficient of Dk (-132 ppm/°C), promoting stable electrical behavior across operational temperature extremes. With high volume and surface resistivity, along with a dielectric breakdown strength exceeding 45 kV, IsoClad 933 is built for reliability in challenging environments.
Robust Mechanical and Environmental Properties
Despite its flexibility, IsoClad 933 is a robust material. It uses a higher fiberglass-to-PTFE ratio than other IsoClad variants, providing enhanced dimensional stability and increased mechanical strength. It exhibits strong tensile, compressive, and flexural modulus values, ensuring it can withstand the rigors of PCB fabrication and assembly. The material boasts a low moisture absorption rate of 0.05% and meets NASA outgassing requirements (with very low TML and CVCM), making it a trusted choice for aerospace and space-grade applications. It also carries a UL 94 V-0 flammability rating.
Standard Thicknesses:
IsoClad 917: 0.031" (0.79mm) and 0.062" (1.57mm), both with a tolerance of ±0.0030".
IsoClad 933: 0.015" (0.38mm), 0.031" (0.79mm), and 0.062" (1.57mm), all with a tolerance of ±0.0030"
Additional non-standard thicknesses are available from 0.005" to 0.125" in increments of 0.005".
Standard Panel Sizes: 12" x 18" (305mm x 457mm), 24" x 18" (610mm x 457mm)
Additional panel sizes are available upon request.
Standard Claddings: Electrodeposited Copper Foil
½ oz. (18µm) – Designation: HH/HH
1 oz. (35µm) – Designation: *H1/H1*
Additional cladding options are available, including:
Heavy metal cladding
Resistive foil
Unclad (bare dielectric) material
Ideal for Mission-Critical Applications
Conformal and Phased Array Antennas for aerospace and defense platforms
Missile Guidance Systems
Radar and Electronic Warfare (EW) Systems
High-Frequency Stripline and Microstrip Circuits
For engineers designing next-generation RF systems that must conform to non-planar surfaces or require exceptional dimensional predictability, IsoClad 933 provides a proven, high-performance substrate solution. Its isotropic nature and tailored reinforcement offer a unique value proposition that bridges the gap between electrical performance and mechanical versatility.
Contact our team today to discuss how IsoClad 933 can meet the specific demands of your project, request detailed specifications, or obtain samples for evaluation. We are here to provide the material expertise and support to ensure the success of your most advanced RF designs.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2〜10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
IsoClad® 933 Copper-Clad Laminate: The Optimized Choice for Conformal and Low-Loss RF Designs
We are pleased to introduce the IsoClad® 933, a premium high-frequency laminate engineered to deliver an exceptional balance of mechanical flexibility, electrical performance, and isotropic stability. Part of Rogers Corporation's renowned IsoClad series, this material utilizes a unique nonwoven fiberglass reinforcement within a PTFE matrix, setting it apart from traditional woven glass substrates and making it an ideal solution for advanced, conformal RF applications.
Engineered for Flexibility and Isotropic Consistency
The core innovation of IsoClad 933 lies in its nonwoven fiberglass structure. This design yields a material that is significantly less rigid than standard woven fiberglass laminates, providing the flexibility required for conformal antennas and curved electronic assemblies. Crucially, the random orientation of the fibers results in highly isotropic properties in the X, Y, and Z directions. This means the material behaves uniformly regardless of direction, leading to more predictable electrical performance, reduced risk of warpage, and simplified modeling for complex circuit designs—a critical advantage for stripline and microstrip circuits.
| Typical Properties: IsoClad | ||||
| Property | Test Method | Condition | IsoClad 917 | IsoClad 933 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 | 2.33 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0013 | 0.0016 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted | -10°C to +140°C | -157 | -132 |
| c | IPC TM-650 2.4.8 | After Thermal | 10 | 10 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.5 x 10 10 | 3.5 x 10 8 |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.0 x 10 9 | 1.0 x 10 8 |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 133, 120 | 173, 147 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 4.3, 3.8 | 6.8, 5.3 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 182 | 197 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 213 | 239 |
| Dielectric Breakdown (kv) | ASTM D-149 | D48/50 | >45 | >45 |
| Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 | 2.27 |
| Water Absorption (%) | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.04 | 0.05 |
| Coefficient of Thermal | IPC TM-650 2.4.24 Mettler 3000 | 0°C to 100°C | ||
| Expansion (ppm/°C) | Thermomechanical Analyzer | |||
| X Axis | 46 | 31 | ||
| Y Axis | 47 | 35 | ||
| Z Axis | 236 | 203 | ||
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.263 | 0.263 |
| Outgassing | ||||
| Total Mass Loss (%) | Maximum 1.00% | 125°C, ≤10-6 torr | 0.02 | 0.03 |
| Collected Volatile | Maximum 0.10% | 0 | 0 | |
| Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | 0.02 | 0.02 | ||
| NO | NO | |||
| Flammability | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets | Meets |
| requirements of UL94-V0 | requirements of UL94-V0 | |||
Reliable Electrical Performance for Demanding Systems
IsoClad 933 offers dependable electrical characteristics tailored for high-frequency operation. It features a stable dielectric constant (Dk) of 2.33 at 10 GHz and a low dissipation factor (Df) of 0.0016. This combination ensures controlled impedance and minimal signal loss, making it suitable for a wide range of RF applications. The laminate demonstrates a low thermal coefficient of Dk (-132 ppm/°C), promoting stable electrical behavior across operational temperature extremes. With high volume and surface resistivity, along with a dielectric breakdown strength exceeding 45 kV, IsoClad 933 is built for reliability in challenging environments.
Robust Mechanical and Environmental Properties
Despite its flexibility, IsoClad 933 is a robust material. It uses a higher fiberglass-to-PTFE ratio than other IsoClad variants, providing enhanced dimensional stability and increased mechanical strength. It exhibits strong tensile, compressive, and flexural modulus values, ensuring it can withstand the rigors of PCB fabrication and assembly. The material boasts a low moisture absorption rate of 0.05% and meets NASA outgassing requirements (with very low TML and CVCM), making it a trusted choice for aerospace and space-grade applications. It also carries a UL 94 V-0 flammability rating.
Standard Thicknesses:
IsoClad 917: 0.031" (0.79mm) and 0.062" (1.57mm), both with a tolerance of ±0.0030".
IsoClad 933: 0.015" (0.38mm), 0.031" (0.79mm), and 0.062" (1.57mm), all with a tolerance of ±0.0030"
Additional non-standard thicknesses are available from 0.005" to 0.125" in increments of 0.005".
Standard Panel Sizes: 12" x 18" (305mm x 457mm), 24" x 18" (610mm x 457mm)
Additional panel sizes are available upon request.
Standard Claddings: Electrodeposited Copper Foil
½ oz. (18µm) – Designation: HH/HH
1 oz. (35µm) – Designation: *H1/H1*
Additional cladding options are available, including:
Heavy metal cladding
Resistive foil
Unclad (bare dielectric) material
Ideal for Mission-Critical Applications
Conformal and Phased Array Antennas for aerospace and defense platforms
Missile Guidance Systems
Radar and Electronic Warfare (EW) Systems
High-Frequency Stripline and Microstrip Circuits
For engineers designing next-generation RF systems that must conform to non-planar surfaces or require exceptional dimensional predictability, IsoClad 933 provides a proven, high-performance substrate solution. Its isotropic nature and tailored reinforcement offer a unique value proposition that bridges the gap between electrical performance and mechanical versatility.
Contact our team today to discuss how IsoClad 933 can meet the specific demands of your project, request detailed specifications, or obtain samples for evaluation. We are here to provide the material expertise and support to ensure the success of your most advanced RF designs.
