Low DK 2.55 AD255C PTFE Copper Clad Laminate: High-Performance Antenna Material for Wireless Applications

AD255C Copper Clad Laminate: High-Performance Antenna Material for Wireless Applications

Rogers Corporation introduces the AD255C, a premium glass-reinforced PTFE-based laminate specifically engineered to meet the demanding requirements of today's wireless antenna markets. As part of the AD Series™ antenna materials, the AD255C delivers controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) characteristics—making it an ideal choice for a wide range of antenna applications where reliability and consistency are paramount.

Electrical Performance

The AD255C features a process dielectric constant (Dk) of 2.55 at 10 GHz with a design Dk of 2.60, providing exceptional consistency and tight control that enables precise impedance matching and repeatable circuit performance. The dissipation factor (Df) is an impressively low 0.0013 at 10 GHz, ensuring minimal signal loss and high efficiency in power-sensitive applications.

AD255C Typical Value

Key electrical properties include:

Thermal Coefficient of Dielectric Constant: -110 ppm/°C, ensuring stable performance across temperature variations

• Volume Resistivity: 7.4 × 10⁸ MΩ-cm
• Surface Resistivity: 3.6 × 10⁷ MΩ
• Electrical Strength: 911 V/mil
• Dielectric Breakdown: >40 kV in X/Y direction

PIM Performance
The AD255C delivers exceptional passive intermodulation performance with typical PIM values of -159 to -163 dBc (tested with S1 foil at 1900 MHz). This ultra-low PIM characteristic makes the AD255C particularly well-suited for sensitive antenna systems where distortion cannot be tolerated, including multi-carrier base station antennas and high-density wireless infrastructure.

Thermal Properties:

• Decomposition Temperature (Td): >500°C
• Coefficient of Thermal Expansion (CTE): 34 ppm/°C (X-axis), 26 ppm/°C (Y-axis), 196 ppm/°C (Z-axis)
• Thermal Conductivity: 0.35 W/(m·K)
• Time to Delamination: >60 minutes at 288°C

Mechanical Properties:

• Copper Peel Strength: 2.4 N/mm (13.6 lbs/in) with 1 oz copper
• Flexural Strength: 60.7/44.1 MPa (8.8/6.4 ksi) MD/CMD
• Tensile Strength: 55.8/45.5 MPa (8.1/6.6 ksi) MD/CMD
• Flex Modulus: 6,412/5,640 MPa (930/818 ksi) MD/CMD
• Dimensional Stability: 0.03/0.07 mils/inch (MD/CMD) after etch and bake

Physical Characteristics

• Moisture Absorption: 0.03%, ensuring stable performance in humid environments
• Density: 2.28 g/cm³
• Specific Heat Capacity: 0.813 J/g·K
• Flammability Rating: UL 94 V-0

Versatile Applications

Cellular base station antennas

Phased array antennas

Passive components (couplers, dividers, filters, combiners)

RF identification (RFID) systems

Satellite communication antennas

Automotive antenna systems

Low-noise amplifiers and receivers

Processing and Fabrication
As a woven glass-reinforced PTFE material, the AD255C offers excellent circuit processability and enables high-yield circuit board fabrication. The material can be processed using standard PTFE fabrication techniques:

Compatible with mechanical drilling and routing

Supports plated through-hole processing with standard methods

Can be etched using conventional chemical solutions

Excellent dimensional stability throughout fabrication

Available with both standard electrodeposited (ED) and reverse treated ED copper foil options

Copper Foil Options
The AD255C is offered with multiple copper foil options to suit specific application requirements:

Electrodeposited (ED) Copper: ½ oz. (18μm) and 1 oz. (35μm)

Reverse Treated ED Copper: ½ oz. (18μm) and 1 oz. (35μm) — provides improved PIM performance

Standard Thicknesses:

0.020" (0.508 mm) ±0.002"

0.030" (0.762 mm) ±0.002"

0.040" (1.016 mm) ±0.002"

0.060" (1.524 mm) ±0.002"

0.125" (3.175 mm) ±0.006"

Standard Panel Sizes:

12" × 18" (305mm × 457mm)

18" × 12" (457mm × 305mm)

18" × 24" (457mm × 610mm)

24" × 18" (610mm × 457mm)

Custom thicknesses, panel sizes, and claddings are available upon request—please contact our customer service team for more information.

Production Capabilities and Supply Chain

Production Capacity: High-volume manufacturing with advanced PTFE processing technologies

Quality Assurance: Rigorous testing in accordance with IPC-TM-650 standards

Global Footprint: Manufacturing and distribution facilities serving customers worldwide

Customization: Flexible production lines accommodate both prototype and high-volume requirements

Storage Requirements:

Store in a clean, dry environment at 10°C to 35°C

Maintain relative humidity below 70%

Keep in original moisture-resistant packaging until ready for use

Avoid exposure to direct sunlight, corrosive gases, and extreme temperature fluctuations

Store panels flat to prevent warpage

Recommended shelf life: 12 months under proper storage conditions

Transportation:

Laminates are packaged with protective interleaving to prevent surface damage

Secure edge protection minimizes risk of damage during transit

Moisture-barrier packaging protects against humidity

Multiple packaging options available for domestic and international shipping

Full compliance with international shipping regulations for electronic materials

Why Choose AD255C?
The AD255C combines Rogers' proven PTFE-based technology with specific optimizations for antenna applications. Its controlled Dk, low loss, excellent PIM performance, and high copper peel strength make it an ideal choice for designers seeking consistent, high-performance materials for wireless infrastructure. With its tight tolerances and excellent processability, the AD255C delivers reliable performance from prototype through high-volume production.

Contact us Corporation today to discuss how AD255C can meet your specific antenna design requirements.