|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 10000個 |
F4BME255 Copper Clad Laminate: Low-PIM PTFE Composite for High-Frequency Applications
Taizhou Wangling Insulating Materials Factory presents the F4BME255, a high-performance PTFE glass fabric reinforced copper clad laminate engineered for applications demanding exceptional passive intermodulation (PIM) performance. As part of our F4BME series, this material combines stable electrical properties with advanced reverse treated copper foil technology to deliver superior signal integrity for RF and microwave designs.
Electrical Performance with Low-PIM Technology
The F4BME255 features a dielectric constant (Dk) of 2.55 ±0.05 at 10 GHz, providing stable and predictable electrical performance critical for controlled impedance designs. The dissipation factor (Df) is exceptionally low:
0.0013 at 10 GHz
0.0018 at 20 GHz
F4BME series
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 2,534 | 2,534 | 2,230 | 2,025 | 1,621 | 1,417 | 1,416 | 1,215 | 1,215 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|||||||||
What truly distinguishes the F4BME255 is its outstanding PIM performance. With a PIM value of ≤ -159 dBc, this material is specifically optimized for applications where passive intermodulation distortion cannot be tolerated.
The reverse treated copper foil (RTF) technology delivers:
Superior PIM characteristics for high-sensitivity receiver systems
More precise circuit line control through reduced copper surface roughness
Lower conductor loss compared to standard electrodeposited copper
The thermal coefficient of dielectric constant is -110 ppm/°C from -55°C to 150°C, ensuring stable electrical performance across a wide operating temperature range. Volume resistivity exceeds 6 × 10⁶ MΩ·cm, while surface resistivity is ≥1 × 10⁶ MΩ, providing robust insulation characteristics.
Thermal Performance:
Coefficient of Thermal Expansion (CTE): 16-21 ppm/°C (X/Y direction), 173 ppm/°C (Z direction)
Thermal Conductivity: 0.33 W/(m·K)—enhanced heat dissipation for power applications
Long-Term Operating Temperature: -55°C to +260°C
Thermal Stress: Withstands 260°C for 10 seconds over three cycles without delamination
Mechanical Excellence:
Copper Peel Strength: >1.6 N/mm with 1 oz RTF copper
Moisture Absorption: ≤0.08%, ensuring consistent performance in humid environments
Density: 2.25 g/cm³
Flammability Rating: UL 94 V-0
Versatile Applications
Microwave and RF circuits
Radar systems
Phase shifters and passive components
Power dividers, couplers, and combiners
Feed networks and phased array antennas
Satellite communications and base station antennas
Processing and Fabrication
The F4BME255 is designed for manufacturability using standard PTFE fabrication techniques:
Compatible with conventional PCB processing equipment
Excellent machinability for drilling, routing, and shearing
Resistant to all common etching chemicals and solvents
Supports both through-hole and surface-mount technologies
Excellent dimensional stability throughout fabrication
The RTF copper foil features a specially treated surface that provides superior adhesion while maintaining the smooth signal-carrying surface essential for low-loss performance.
Standard Configurations
Copper Foil Options (F4BME Series):
0.5 oz (0.018mm) reverse treated copper foil
1 oz (0.035mm) reverse treated copper foil
Standard Panel Sizes:
460 × 610mm (18" × 24")
500 × 600mm
850 × 1200mm
914 × 1220mm (36" × 48")
1000 × 1200mm
Custom Sizes Available:
300 × 250mm, 350 × 380mm, 500 × 500mm, 840 × 840mm, 1000 × 1500mm
Thickness Options:
Available from 0.1mm to 12.0mm (specify whether total thickness or dielectric thickness)
For Dk ≤ 2.65, minimum dielectric thickness: 0.1mm
For Dk 2.7–3.0, minimum dielectric thickness: 0.2mm
Metal-Backed Configurations:
F4BME255-AL: Aluminum-backed for lightweight thermal management
F4BME255-CU: Copper-backed for maximum heat dissipation
Production Capabilities and Quality Assurance
As a specialized manufacturer of PTFE-based circuit materials, Taizhou Wangling maintains rigorous quality control throughout the production process:
Advanced Manufacturing: Precision resin impregnation, high-temperature lamination, and strict process control
Production Capacity: Scalable manufacturing to support both prototype and high-volume requirements
Quality Testing: All materials tested in accordance with IPC-TM-650 and GB/T standards
Lot Traceability: Complete material traceability for quality assurance
Storage Requirements:
Store in clean, dry environment at 10°C to 35°C
Maintain relative humidity below 70%
Keep in original packaging until ready for use
Avoid direct sunlight, corrosive gases, and extreme temperature fluctuations
Store panels flat to prevent warpage
Recommended shelf life: 12 months under proper conditions
Transportation:
Protective interleaving prevents surface damage
Secure edge protection minimizes transit damage
Moisture-barrier packaging for humidity protection
Multiple packaging options for domestic and international shipping
Compliant with international electronic material shipping regulations
Why Choose F4BME255?
The F4BME255 combines stable electrical properties, ultra-low PIM performance, and excellent thermal characteristics in a cost-effective, high-volume manufacturable platform. Its RTF copper technology delivers superior signal integrity while maintaining strong adhesion, making it an ideal choice for designers seeking reliable, high-performance materials for demanding RF applications.
Contact Taizhou Wangling Insulating Materials Factory today to discuss how F4BME255 can meet your specific high-frequency design requirements.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 10000個 |
F4BME255 Copper Clad Laminate: Low-PIM PTFE Composite for High-Frequency Applications
Taizhou Wangling Insulating Materials Factory presents the F4BME255, a high-performance PTFE glass fabric reinforced copper clad laminate engineered for applications demanding exceptional passive intermodulation (PIM) performance. As part of our F4BME series, this material combines stable electrical properties with advanced reverse treated copper foil technology to deliver superior signal integrity for RF and microwave designs.
Electrical Performance with Low-PIM Technology
The F4BME255 features a dielectric constant (Dk) of 2.55 ±0.05 at 10 GHz, providing stable and predictable electrical performance critical for controlled impedance designs. The dissipation factor (Df) is exceptionally low:
0.0013 at 10 GHz
0.0018 at 20 GHz
F4BME series
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 2,534 | 2,534 | 2,230 | 2,025 | 1,621 | 1,417 | 1,416 | 1,215 | 1,215 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|||||||||
What truly distinguishes the F4BME255 is its outstanding PIM performance. With a PIM value of ≤ -159 dBc, this material is specifically optimized for applications where passive intermodulation distortion cannot be tolerated.
The reverse treated copper foil (RTF) technology delivers:
Superior PIM characteristics for high-sensitivity receiver systems
More precise circuit line control through reduced copper surface roughness
Lower conductor loss compared to standard electrodeposited copper
The thermal coefficient of dielectric constant is -110 ppm/°C from -55°C to 150°C, ensuring stable electrical performance across a wide operating temperature range. Volume resistivity exceeds 6 × 10⁶ MΩ·cm, while surface resistivity is ≥1 × 10⁶ MΩ, providing robust insulation characteristics.
Thermal Performance:
Coefficient of Thermal Expansion (CTE): 16-21 ppm/°C (X/Y direction), 173 ppm/°C (Z direction)
Thermal Conductivity: 0.33 W/(m·K)—enhanced heat dissipation for power applications
Long-Term Operating Temperature: -55°C to +260°C
Thermal Stress: Withstands 260°C for 10 seconds over three cycles without delamination
Mechanical Excellence:
Copper Peel Strength: >1.6 N/mm with 1 oz RTF copper
Moisture Absorption: ≤0.08%, ensuring consistent performance in humid environments
Density: 2.25 g/cm³
Flammability Rating: UL 94 V-0
Versatile Applications
Microwave and RF circuits
Radar systems
Phase shifters and passive components
Power dividers, couplers, and combiners
Feed networks and phased array antennas
Satellite communications and base station antennas
Processing and Fabrication
The F4BME255 is designed for manufacturability using standard PTFE fabrication techniques:
Compatible with conventional PCB processing equipment
Excellent machinability for drilling, routing, and shearing
Resistant to all common etching chemicals and solvents
Supports both through-hole and surface-mount technologies
Excellent dimensional stability throughout fabrication
The RTF copper foil features a specially treated surface that provides superior adhesion while maintaining the smooth signal-carrying surface essential for low-loss performance.
Standard Configurations
Copper Foil Options (F4BME Series):
0.5 oz (0.018mm) reverse treated copper foil
1 oz (0.035mm) reverse treated copper foil
Standard Panel Sizes:
460 × 610mm (18" × 24")
500 × 600mm
850 × 1200mm
914 × 1220mm (36" × 48")
1000 × 1200mm
Custom Sizes Available:
300 × 250mm, 350 × 380mm, 500 × 500mm, 840 × 840mm, 1000 × 1500mm
Thickness Options:
Available from 0.1mm to 12.0mm (specify whether total thickness or dielectric thickness)
For Dk ≤ 2.65, minimum dielectric thickness: 0.1mm
For Dk 2.7–3.0, minimum dielectric thickness: 0.2mm
Metal-Backed Configurations:
F4BME255-AL: Aluminum-backed for lightweight thermal management
F4BME255-CU: Copper-backed for maximum heat dissipation
Production Capabilities and Quality Assurance
As a specialized manufacturer of PTFE-based circuit materials, Taizhou Wangling maintains rigorous quality control throughout the production process:
Advanced Manufacturing: Precision resin impregnation, high-temperature lamination, and strict process control
Production Capacity: Scalable manufacturing to support both prototype and high-volume requirements
Quality Testing: All materials tested in accordance with IPC-TM-650 and GB/T standards
Lot Traceability: Complete material traceability for quality assurance
Storage Requirements:
Store in clean, dry environment at 10°C to 35°C
Maintain relative humidity below 70%
Keep in original packaging until ready for use
Avoid direct sunlight, corrosive gases, and extreme temperature fluctuations
Store panels flat to prevent warpage
Recommended shelf life: 12 months under proper conditions
Transportation:
Protective interleaving prevents surface damage
Secure edge protection minimizes transit damage
Moisture-barrier packaging for humidity protection
Multiple packaging options for domestic and international shipping
Compliant with international electronic material shipping regulations
Why Choose F4BME255?
The F4BME255 combines stable electrical properties, ultra-low PIM performance, and excellent thermal characteristics in a cost-effective, high-volume manufacturable platform. Its RTF copper technology delivers superior signal integrity while maintaining strong adhesion, making it an ideal choice for designers seeking reliable, high-performance materials for demanding RF applications.
Contact Taizhou Wangling Insulating Materials Factory today to discuss how F4BME255 can meet your specific high-frequency design requirements.
