|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
8-Layer Multilayer PCB with RO4003C
This custom-engineered printed circuit board is designed for demanding high-frequency and high-speed digital applications. Featuring a robust multilayer stack-up of Rogers RO4003C laminates and RO4450F bondply, this board delivers exceptional signal integrity, thermal management, and mechanical stability.
Key Specifications
| Parameter | Details |
| Layer Count | 8 Layers |
| Material | RO4003C (Rogers Laminate) + RO4450F Prepreg |
| Core Build | 4 Core Boards: 1.524mm + 1.524mm + 0.762mm + 0.762mm |
| Lamination Thickness | 5.05 mm |
| Copper Weight | Outer: 1 oz / Inner: 0.5 oz |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Top: Green (No Legend) / Bottom: Green with White Lettering |
| Dimensions | 91 mm x 77 mm |
Material Advantage: RO4003C
The board utilizes RO4003C, a hydrocarbon ceramic laminate from Rogers Corporation. Unlike standard FR4, RO4003C offers:
Stable Dielectric Constant (Dk): 3.38 ± 0.05 for precise impedance control
Low Dissipation Factor (Df): 0.0027 @ 10 GHz minimizes signal loss
Excellent Thermal Conductivity: 0.71 W/m/K for efficient heat dissipation
Consistent Performance: Reliable across frequency and temperature variations
The RO4450F bondply ensures robust multilayer bonding and thermal stability throughout the stack.
Multilayer Board Fabrication Guide for RO4003C
Inner Layer Preparation
Surface Preparation: Chemical cleaning and micro-etching is recommended for thinner cores, while mechanical scrubbing is suitable for thicker laminates.
Oxide Treatment: RO4003C cores can be processed through standard copper oxide or alternative treatments to prepare for multilayer bonding.
Drilling Guidelines
| Parameter | Recommended Range |
| Surface Speed | 300-500 SFM (90-150 m/min) |
| Chip Load | 0.002"-0.004"/rev (0.05-0.10 mm) |
| Tool Type | Standard carbide drills |
| Tool Life | 2,000-3,000 hits |
Note: Drilling speeds above 500 SFM should be avoided. Expected hole wall roughness: 8-25 µm.
Plated Through-Hole (PTH) Processing
Desmear: Typically not required for double-sided boards. For multilayers, alkaline permanganate or plasma processes may be used.
Etchback: Not recommended as it may loosen filler particles.
Metallization: Compatible with standard electroless copper and direct deposition processes.
Routing Guidelines
| Tool Diameter | Spindle Speed | Feed Rate |
| 1/32" | 40k RPM | 50 IPM |
| 1/16" | 25k RPM | 31 IPM |
| 1/8" | 15k RPM | 25 IPM |
Use carbide multi-fluted spiral routers
Remove copper from routing path to prevent burring
Maximum stack height: 70% of flute length
Applications
This 8-layer RO4003C PCB is ideal for:
Telecommunications: 5G base stations, backhaul equipment
RF/Microwave Circuits: Power amplifiers, filters, low-noise amplifiers
High-Speed Digital: SerDes channels, high-layer count backplanes
Aerospace & Defense: Radar systems, high-reliability communications
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
8-Layer Multilayer PCB with RO4003C
This custom-engineered printed circuit board is designed for demanding high-frequency and high-speed digital applications. Featuring a robust multilayer stack-up of Rogers RO4003C laminates and RO4450F bondply, this board delivers exceptional signal integrity, thermal management, and mechanical stability.
Key Specifications
| Parameter | Details |
| Layer Count | 8 Layers |
| Material | RO4003C (Rogers Laminate) + RO4450F Prepreg |
| Core Build | 4 Core Boards: 1.524mm + 1.524mm + 0.762mm + 0.762mm |
| Lamination Thickness | 5.05 mm |
| Copper Weight | Outer: 1 oz / Inner: 0.5 oz |
| Surface Finish | Immersion Gold (ENIG) |
| Solder Mask | Top: Green (No Legend) / Bottom: Green with White Lettering |
| Dimensions | 91 mm x 77 mm |
Material Advantage: RO4003C
The board utilizes RO4003C, a hydrocarbon ceramic laminate from Rogers Corporation. Unlike standard FR4, RO4003C offers:
Stable Dielectric Constant (Dk): 3.38 ± 0.05 for precise impedance control
Low Dissipation Factor (Df): 0.0027 @ 10 GHz minimizes signal loss
Excellent Thermal Conductivity: 0.71 W/m/K for efficient heat dissipation
Consistent Performance: Reliable across frequency and temperature variations
The RO4450F bondply ensures robust multilayer bonding and thermal stability throughout the stack.
Multilayer Board Fabrication Guide for RO4003C
Inner Layer Preparation
Surface Preparation: Chemical cleaning and micro-etching is recommended for thinner cores, while mechanical scrubbing is suitable for thicker laminates.
Oxide Treatment: RO4003C cores can be processed through standard copper oxide or alternative treatments to prepare for multilayer bonding.
Drilling Guidelines
| Parameter | Recommended Range |
| Surface Speed | 300-500 SFM (90-150 m/min) |
| Chip Load | 0.002"-0.004"/rev (0.05-0.10 mm) |
| Tool Type | Standard carbide drills |
| Tool Life | 2,000-3,000 hits |
Note: Drilling speeds above 500 SFM should be avoided. Expected hole wall roughness: 8-25 µm.
Plated Through-Hole (PTH) Processing
Desmear: Typically not required for double-sided boards. For multilayers, alkaline permanganate or plasma processes may be used.
Etchback: Not recommended as it may loosen filler particles.
Metallization: Compatible with standard electroless copper and direct deposition processes.
Routing Guidelines
| Tool Diameter | Spindle Speed | Feed Rate |
| 1/32" | 40k RPM | 50 IPM |
| 1/16" | 25k RPM | 31 IPM |
| 1/8" | 15k RPM | 25 IPM |
Use carbide multi-fluted spiral routers
Remove copper from routing path to prevent burring
Maximum stack height: 70% of flute length
Applications
This 8-layer RO4003C PCB is ideal for:
Telecommunications: 5G base stations, backhaul equipment
RF/Microwave Circuits: Power amplifiers, filters, low-noise amplifiers
High-Speed Digital: SerDes channels, high-layer count backplanes
Aerospace & Defense: Radar systems, high-reliability communications
