|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2〜10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
F4BM265 PTFE/Glass Fiber Copper Clad Laminate: A Cost-Effective High-Frequency Solution
The F4BM265 is a high-performance PTFE (polytetrafluoroethylene) and woven glass fiber reinforced copper clad laminate developed by Taizhou Wangling Insulation Material Factory. It is designed as a domestically produced, high-value alternative to international high-frequency circuit materials, offering a balanced combination of stable electrical properties, good mechanical strength, and excellent thermal reliability for a wide range of RF and microwave applications.
A key feature of the F4BM series is its tunable dielectric constant (Dk), achieved by precisely adjusting the ratio of PTFE resin to glass fabric. The F4BM265 variant offers a mid-range Dk of 2.65, positioning it as an optimal choice for designs requiring a balance between signal propagation speed, impedance control, and dimensional stability. As a member of the F4BM line, it utilizes standard Electrodeposited (ED) copper foil, making it suitable for applications without stringent Passive Intermodulation (PIM) requirements, such as various passive components and subsystems.
This material is engineered for stability and durability. It exhibits low dielectric loss, good thermal resistance capable of withstanding lead-free soldering processes, and a very low moisture absorption rate. Its UL 94 V-0 flammability rating ensures safety for commercial use. The laminate is well-suited for microwave circuits, RF components, base station antennas, and satellite communication equipment, providing a reliable and cost-effective substrate solution.
Data Sheet
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BM217 | F4BM220 | F4BM233 | F4BM245 | F4BM255 | F4BM265 | F4BM275 | F4BM294 | F4BM300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|||||||||
Standard Specifications of F4BM265 Laminate:
Electrical Properties:
Dielectric Constant (Dk) @ 10 GHz: 2.65 ±0.05
Dissipation Factor (Df): 0.0013 @ 10 GHz, 0.0019 @ 20 GHz
Thermal Coefficient of Dk: -100 ppm/°C (-55°C to 150°C)
Volume Resistivity: ≥ 6 x 10⁶ MΩ·cm
Surface Resistivity: ≥ 1 x 10⁶ MΩ
Dielectric Strength (Z-direction): > 25 KV/mm
Breakdown Voltage (XY-direction): > 34 KV
Coefficient of Thermal Expansion (CTE):
Mechanical Properties:
Peel Strength (with 1 oz. ED Cu): > 1.8 N/mm
Thermal Stress Performance: No delamination after 3 cycles of 10s at 260°C
Standard Product Offerings:
Cladding: Standard Electrodeposited (ED) Copper Foil.
Available Copper Weights: 0.5 oz (18µm), 1 oz (35µm), 1.5 oz (50µm), 2 oz (70µm).
Standard Panel Sizes: Includes 460 x 610 mm, 500 x 600 mm, 850 x 1200 mm, 914 x 1220 mm, and 1000 x 1200 mm.
Standard Thickness (Dielectric Core): A wide range is available from 0.1 mm upwards. For Dk≤2.65, the minimum core thickness is 0.1mm.
Metal-Clad Variants: Available as aluminum-base (F4BM265-AL) or copper-base (F4BM265-CU) laminates for enhanced shielding or heat dissipation.
In summary, the F4BM265 laminate delivers a compelling mix of stable mid-range dielectric properties, manufacturing versatility, and robust performance. Its wide range of available thicknesses, panel sizes, and cladding options, including metal-core versions, makes it a highly adaptable and economical choice for designers and manufacturers across the telecommunications, aerospace, and defense industries.
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|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2〜10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
F4BM265 PTFE/Glass Fiber Copper Clad Laminate: A Cost-Effective High-Frequency Solution
The F4BM265 is a high-performance PTFE (polytetrafluoroethylene) and woven glass fiber reinforced copper clad laminate developed by Taizhou Wangling Insulation Material Factory. It is designed as a domestically produced, high-value alternative to international high-frequency circuit materials, offering a balanced combination of stable electrical properties, good mechanical strength, and excellent thermal reliability for a wide range of RF and microwave applications.
A key feature of the F4BM series is its tunable dielectric constant (Dk), achieved by precisely adjusting the ratio of PTFE resin to glass fabric. The F4BM265 variant offers a mid-range Dk of 2.65, positioning it as an optimal choice for designs requiring a balance between signal propagation speed, impedance control, and dimensional stability. As a member of the F4BM line, it utilizes standard Electrodeposited (ED) copper foil, making it suitable for applications without stringent Passive Intermodulation (PIM) requirements, such as various passive components and subsystems.
This material is engineered for stability and durability. It exhibits low dielectric loss, good thermal resistance capable of withstanding lead-free soldering processes, and a very low moisture absorption rate. Its UL 94 V-0 flammability rating ensures safety for commercial use. The laminate is well-suited for microwave circuits, RF components, base station antennas, and satellite communication equipment, providing a reliable and cost-effective substrate solution.
Data Sheet
| Product Technical Parameters | Product Model & Data Sheet | |||||||||||
| Product Features | Test Conditions | Unit | F4BM217 | F4BM220 | F4BM233 | F4BM245 | F4BM255 | F4BM265 | F4BM275 | F4BM294 | F4BM300 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|||||||||
Standard Specifications of F4BM265 Laminate:
Electrical Properties:
Dielectric Constant (Dk) @ 10 GHz: 2.65 ±0.05
Dissipation Factor (Df): 0.0013 @ 10 GHz, 0.0019 @ 20 GHz
Thermal Coefficient of Dk: -100 ppm/°C (-55°C to 150°C)
Volume Resistivity: ≥ 6 x 10⁶ MΩ·cm
Surface Resistivity: ≥ 1 x 10⁶ MΩ
Dielectric Strength (Z-direction): > 25 KV/mm
Breakdown Voltage (XY-direction): > 34 KV
Coefficient of Thermal Expansion (CTE):
Mechanical Properties:
Peel Strength (with 1 oz. ED Cu): > 1.8 N/mm
Thermal Stress Performance: No delamination after 3 cycles of 10s at 260°C
Standard Product Offerings:
Cladding: Standard Electrodeposited (ED) Copper Foil.
Available Copper Weights: 0.5 oz (18µm), 1 oz (35µm), 1.5 oz (50µm), 2 oz (70µm).
Standard Panel Sizes: Includes 460 x 610 mm, 500 x 600 mm, 850 x 1200 mm, 914 x 1220 mm, and 1000 x 1200 mm.
Standard Thickness (Dielectric Core): A wide range is available from 0.1 mm upwards. For Dk≤2.65, the minimum core thickness is 0.1mm.
Metal-Clad Variants: Available as aluminum-base (F4BM265-AL) or copper-base (F4BM265-CU) laminates for enhanced shielding or heat dissipation.
In summary, the F4BM265 laminate delivers a compelling mix of stable mid-range dielectric properties, manufacturing versatility, and robust performance. Its wide range of available thicknesses, panel sizes, and cladding options, including metal-core versions, makes it a highly adaptable and economical choice for designers and manufacturers across the telecommunications, aerospace, and defense industries.
