RO3206 PCB 25mil thickness substrate double Layer with Immersion Gold Finish for Microstrip patch antennas

RO3206 PCB: 2-Layer, 25mil Core, 0.75mm Thickness with Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

Overview of RO3206 2-Layer PCB

The RO3206 PCB is a high-performance 2-layer rigid PCB designed for RF, microwave, and high-frequency applications. Built with Rogers RO3206 laminates, this PCB features a 25mil (0.635mm) core and a finished thickness of 0.75mm, ensuring exceptional electrical performance, mechanical stability, and low dielectric loss. With a dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz and a dissipation factor of 0.0027, the RO3206 PCB is an ideal choice for wireless communication systems and automotive radar applications.

The blue solder mask, white silkscreen on the top layer, and Immersion Gold (ENIG) surface finish enhance the board's durability, aesthetics, and solderability, making it suitable for high-precision and high-frequency designs.

PCB Construction Details

PCB Stackup

Introduction to RO3206 Material

The Rogers RO3206 laminates are ceramic-filled, woven fiberglass-reinforced PTFE composites, offering superior electrical and mechanical stability. These laminates are widely used in high-frequency circuits due to their low dielectric loss, high thermal conductivity, and excellent dimensional stability. The material's characteristics make it perfect for complex multilayer structures and surface-mounted assemblies.

Key Features of RO3206

• Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz / 23°C.
• Dissipation Factor: Low at 0.0027 at 10 GHz.
• Thermal Conductivity: 0.67 W/mK for superior heat dissipation.
• CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C. Z-axis: 34 ppm/°C.
• Moisture Absorption: Very low at <0.1%.
• Peel Strength: Strong copper adhesion at 10.7 lbs/in.

Benefits of RO3206

• Woven Glass Reinforcement: Improves rigidity for easier handling.
• Uniform Electrical and Mechanical Properties: Ensures consistent performance in high-frequency designs.
• Low Dielectric Loss: Ideal for RF and microwave applications.
• Dimensional Stability: High production yields and reliability.
• Cost-Effective: Economical for volume manufacturing.
• Surface Smoothness: Enables finer line etching tolerances.

Applications

Automotive Collision Avoidance Systems

Global Positioning Antennas

Wireless Telecommunications Systems

Microstrip Patch Antennas

Direct Broadcast Satellites

Datalink on Cable Systems

Remote Meter Readers

Power Backplanes

LMDS and Wireless Broadband

Conclusion

The RO3206 2-layer PCB is a high-performance solution for RF, microwave, and high-frequency designs, offering low dielectric loss, thermal stability, and dimensional accuracy. With its 25mil RO3206 core, blue solder mask, and Immersion Gold finish, this PCB delivers consistent performance for demanding applications such as automotive radar systems, wireless telecommunications, and satellite communications.

Compliant with IPC-Class-2 standards and available worldwide, the RO3206 PCB is the perfect choice for engineers seeking cost-effective, high-frequency PCB solutions.