|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
10-Layer Hybrid High-Frequency PCB | RO4003C + 370HR | Immersion Gold Finish
Product Overview
We are pleased to present this newly customized 10-layer rigid PCB featuring a hybrid stackup that combines Rogers RO4003C high-frequency hydrocarbon ceramic laminates with Isola 370HR high-performance FR-4 epoxy systems. This advanced construction is designed for applications demanding superior high-frequency performance on outer layers combined with excellent thermal reliability and cost-effectiveness on inner layers.
The board measures 132mm x 144mm (single piece) with a total laminated thickness of 1.618mm and dimensional tolerance of ±0.15mm. The design incorporates blind vias (L1-L2, L9-L10, L7-L10) and resin-plugged vias for enhanced reliability. Minimum trace and space are not specified but impedance-controlled structures are implemented on critical layers. No statement regarding minimum hole size or blind via restrictions is provided in the base specification.
This design features blue solder mask on both sides with white silkscreen lettering for clear component identification. The Immersion Gold surface finish (135%-150% thickness) provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 10 Layers |
| Base Materials (Hybrid) | Rogers RO4003C (outer layers) + Isola 370HR (inner layers) |
| Board Dimensions | 132mm x 144mm (1 PCB) ±0.15mm |
| Total Laminated Thickness | 1.618mm |
| Finished Cu Weight - Outer Layers | 1 oz (35μm) |
| Finished Cu Weight - Inner Layers | 1 oz / 0.5 oz (mixed – male/female) |
| Via Structures | Blind vias (L1-L2, L9-L10, L7-L10); Resin-plugged vias |
| Surface Finish | Immersion Gold (135%-150%) |
| Top Solder Mask | Blue |
| Bottom Solder Mask | Blue |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
Impedance Control Specifications
| Layer / Structure | Trace Width | Spacing | Target Impedance |
| Top Layer | 12.2 mils | – | 50 Ω |
| Layer 3 | 3.5 mils | 5.5 mils (to adjacent) | 80 Ω (differential pair) |
RO4003C (Rogers Corporation)
The RO4003C™ laminate is a hydrocarbon ceramic material designed to offer superior high-frequency performance with low-cost circuit fabrication. Key characteristics include:
Low dielectric constant (3.38 ±0.05 at 10 GHz) – stable over broad frequency range
Low dissipation factor (0.0027 at 10 GHz) – minimal signal loss at high frequencies
Very low TCDk (+40 ppm/°C) – among the lowest of any circuit board material
High Tg (>280°C) – maintains dimensional stability during processing
FR-4 compatible processing – no specialized via preparation (no sodium etch required)
Low Z-axis CTE (46 ppm/°C) – excellent plated through-hole reliability
Excellent dimensional stability (<0.3 mm/m after etch) – ideal for multilayer constructions
RO4003C is ideal for RF microwave circuits, matching networks, controlled impedance transmission lines, and broadband applications where stable dielectric constant across frequency and temperature is critical.
370HR (Isola Group)
The 370HR is a high-performance multifunctional epoxy FR-4 system with a glass transition temperature of 180°C, designed for multilayer PWB applications requiring maximum thermal performance and reliability. Key characteristics include:
High Tg (180°C by DSC) – excellent thermal reliability for sequential lamination
High decomposition temperature (Td >340°C) – superior thermal stability
T260 >60 minutes, T288 >30 minutes – exceptional thermal stress resistance
Low Z-axis CTE (45 ppm/°C pre-Tg, 230 ppm/°C post-Tg) – reliable PTH performance
Z-axis expansion of only 2.8% (50-260°C) – minimizes stress during soldering
UV blocking and laser fluorescing – compatible with AOI and optical positioning systems
UL 94 V-0 flammability rating – meets fire safety standards
370HR has proven to be best-in-class for sequential lamination designs and provides improved thermal performance and lower expansion rates compared to traditional FR-4 while retaining FR-4 processability.
RO4003C Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (εr) Process | 10 GHz / 23°C | 3.38 ±0.05 | Stable, predictable RF performance |
| Dielectric Constant (εr) Design | 8 to 40 GHz | 3.55 | Broadband design accuracy |
| Dissipation Factor (tan δ) | 10 GHz / 23°C | 0.0027 | Low loss at microwave frequencies |
| Dissipation Factor (tan δ) | 2.5 GHz / 23°C | 0.0021 | Excellent for lower GHz bands |
| TCDk | -50°C to +150°C | +40 ppm/°C | Superior temperature stability |
| CTE (X-axis) | -55°C to +288°C | 11 ppm/°C | Matched to copper |
| CTE (Y-axis) | -55°C to +288°C | 14 ppm/°C | Matched to copper |
| CTE (Z-axis) | -55°C to +288°C | 46 ppm/°C | Reliable PTH under thermal stress |
| Thermal Conductivity | 80°C | 0.71 W/(m·K) | Good heat dissipation |
| Tg (TMA) | – | >280°C | Withstands high-temperature processing |
| Td | TGA | 425°C | Excellent thermal stability |
| Moisture Absorption | 48 hrs immersion, 50°C | 0.06% | Excellent for humid environments |
| Density | 23°C | 1.79 g/cm³ | Lightweight |
| Dimensional Stability | After etch + E2/150°C | <0.3 mm/m | Excellent fabrication precision |
| Flammability Rating | UL 94 | N/A (non-FR) | – |
| Lead-Free Process Compatible | – | Yes | Ready for modern assembly |
370HR Properties
| Property | Test Condition | Value | Benefit |
| Glass Transition Temperature (Tg) | DSC | 180°C | High thermal reliability |
| Decomposition Temperature (Td) | TGA @ 5% weight loss | >340°C | Excellent thermal stability |
| T260 | – | >60 minutes | Thermal stress resistance |
| T288 | – | >30 minutes | Exceptional PTH reliability |
| CTE (X-axis) | Pre-Tg | 13 ppm/°C | Matched to copper |
| CTE (Y-axis) | Pre-Tg | 14 ppm/°C | Matched to copper |
| CTE (Z-axis) | Pre-Tg | 45 ppm/°C | Reliable PTH |
| CTE (Z-axis) | Post-Tg | 230 ppm/°C | – |
| Z-axis Expansion (50-260°C) | – | 2.80% | Minimized soldering stress |
| Thermal Conductivity | ASTM D5930 | 0.4 W/(m·K) | Basic heat dissipation |
| Dielectric Constant (εr) | 100 MHz | 4.24 | Predictable impedance |
| Dielectric Constant (εr) | 1 GHz | 4.17 | Stable across frequency |
| Dissipation Factor (Df) | 100 MHz | 0.015 | Moderate loss |
| Dissipation Factor (Df) | 1 GHz | 0.0161 | Moderate loss |
| Volume Resistivity | After moisture resistance | 3.0×10⁸ MΩ·cm | Good insulation |
| Surface Resistivity | After moisture resistance | 3.0×10⁶ MΩ | Clean signal integrity |
| Electrical Strength | – | 54 kV/mm (1350 V/mil) | High voltage withstand |
| Arc Resistance | – | >115 seconds | Arc withstand capability |
| Moisture Absorption | – | 0.15% | Low moisture uptake |
| Copper Peel Strength | Low profile foil | 1.14 N/mm (6.5 lb/in) | Reliable copper adhesion |
| Flammability Rating | UL 94 | V-0 | Fire safety compliant |
| Max Operating Temperature | UL Certified | 130°C | – |
PCB Stackup & Construction
Via Structures:
Blind vias L1-L2 – connecting top layer to second layer
Blind vias L9-L10 – connecting bottom layer to ninth layer
Blind vias L7-L10 – deeper blind connection from bottom side
Resin-plugged vias – filled and planarized for enhanced reliability
Impedance Control:
Top layer: 12.2 mil trace width for 50Ω single-ended
Layer 3: 3.5 mil trace width with 5.5 mil spacing for 80Ω differential pair
Surface Finish: Immersion Gold (135%-150%)
The Immersion Gold finish offers excellent characteristics for high-reliability, fine-pitch applications:
| Advantage | Description |
| Flat surface | Ideal for fine-pitch components and SMT assembly |
| Excellent solderability | Consistent, repeatable solder joints |
| Superior corrosion resistance | Long shelf life and environmental protection |
| Multiple reflow cycles | Supports lead-free soldering processes |
| Gold thickness 135%-150% | Enhanced durability for demanding applications |
| Cost-effective | Widely available, industry-standard finish |
Typical Applications
Thanks to the hybrid construction combining RO4003C's high-frequency performance with 370HR's thermal reliability, this PCB is ideally suited for:
Key Benefits Summary
| Benefit | Description |
| Hybrid construction | Optimized cost/performance – high-frequency RO4003C on outer layers, cost-effective 370HR internally |
| Low loss at high frequencies | RO4003C provides excellent signal integrity up to 40 GHz |
| High thermal reliability | 370HR offers Tg >280°C (RO4003C) and Tg 180°C (370HR) |
| Superior PTH reliability | Low Z-axis CTE in both materials |
| FR-4 compatible processing | Both materials can be processed using standard FR-4 fabrication techniques |
| Sequential lamination capable | 370HR is proven best-in-class for sequential lamination designs |
| Impedance controlled | 50Ω and 80Ω structures implemented on critical layers |
| Blind and resin-plugged vias | Enables higher routing density and improved reliability |
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
10-Layer Hybrid High-Frequency PCB | RO4003C + 370HR | Immersion Gold Finish
Product Overview
We are pleased to present this newly customized 10-layer rigid PCB featuring a hybrid stackup that combines Rogers RO4003C high-frequency hydrocarbon ceramic laminates with Isola 370HR high-performance FR-4 epoxy systems. This advanced construction is designed for applications demanding superior high-frequency performance on outer layers combined with excellent thermal reliability and cost-effectiveness on inner layers.
The board measures 132mm x 144mm (single piece) with a total laminated thickness of 1.618mm and dimensional tolerance of ±0.15mm. The design incorporates blind vias (L1-L2, L9-L10, L7-L10) and resin-plugged vias for enhanced reliability. Minimum trace and space are not specified but impedance-controlled structures are implemented on critical layers. No statement regarding minimum hole size or blind via restrictions is provided in the base specification.
This design features blue solder mask on both sides with white silkscreen lettering for clear component identification. The Immersion Gold surface finish (135%-150% thickness) provides excellent solderability, flatness for fine-pitch components, and superior corrosion resistance. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 10 Layers |
| Base Materials (Hybrid) | Rogers RO4003C (outer layers) + Isola 370HR (inner layers) |
| Board Dimensions | 132mm x 144mm (1 PCB) ±0.15mm |
| Total Laminated Thickness | 1.618mm |
| Finished Cu Weight - Outer Layers | 1 oz (35μm) |
| Finished Cu Weight - Inner Layers | 1 oz / 0.5 oz (mixed – male/female) |
| Via Structures | Blind vias (L1-L2, L9-L10, L7-L10); Resin-plugged vias |
| Surface Finish | Immersion Gold (135%-150%) |
| Top Solder Mask | Blue |
| Bottom Solder Mask | Blue |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
Impedance Control Specifications
| Layer / Structure | Trace Width | Spacing | Target Impedance |
| Top Layer | 12.2 mils | – | 50 Ω |
| Layer 3 | 3.5 mils | 5.5 mils (to adjacent) | 80 Ω (differential pair) |
RO4003C (Rogers Corporation)
The RO4003C™ laminate is a hydrocarbon ceramic material designed to offer superior high-frequency performance with low-cost circuit fabrication. Key characteristics include:
Low dielectric constant (3.38 ±0.05 at 10 GHz) – stable over broad frequency range
Low dissipation factor (0.0027 at 10 GHz) – minimal signal loss at high frequencies
Very low TCDk (+40 ppm/°C) – among the lowest of any circuit board material
High Tg (>280°C) – maintains dimensional stability during processing
FR-4 compatible processing – no specialized via preparation (no sodium etch required)
Low Z-axis CTE (46 ppm/°C) – excellent plated through-hole reliability
Excellent dimensional stability (<0.3 mm/m after etch) – ideal for multilayer constructions
RO4003C is ideal for RF microwave circuits, matching networks, controlled impedance transmission lines, and broadband applications where stable dielectric constant across frequency and temperature is critical.
370HR (Isola Group)
The 370HR is a high-performance multifunctional epoxy FR-4 system with a glass transition temperature of 180°C, designed for multilayer PWB applications requiring maximum thermal performance and reliability. Key characteristics include:
High Tg (180°C by DSC) – excellent thermal reliability for sequential lamination
High decomposition temperature (Td >340°C) – superior thermal stability
T260 >60 minutes, T288 >30 minutes – exceptional thermal stress resistance
Low Z-axis CTE (45 ppm/°C pre-Tg, 230 ppm/°C post-Tg) – reliable PTH performance
Z-axis expansion of only 2.8% (50-260°C) – minimizes stress during soldering
UV blocking and laser fluorescing – compatible with AOI and optical positioning systems
UL 94 V-0 flammability rating – meets fire safety standards
370HR has proven to be best-in-class for sequential lamination designs and provides improved thermal performance and lower expansion rates compared to traditional FR-4 while retaining FR-4 processability.
RO4003C Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (εr) Process | 10 GHz / 23°C | 3.38 ±0.05 | Stable, predictable RF performance |
| Dielectric Constant (εr) Design | 8 to 40 GHz | 3.55 | Broadband design accuracy |
| Dissipation Factor (tan δ) | 10 GHz / 23°C | 0.0027 | Low loss at microwave frequencies |
| Dissipation Factor (tan δ) | 2.5 GHz / 23°C | 0.0021 | Excellent for lower GHz bands |
| TCDk | -50°C to +150°C | +40 ppm/°C | Superior temperature stability |
| CTE (X-axis) | -55°C to +288°C | 11 ppm/°C | Matched to copper |
| CTE (Y-axis) | -55°C to +288°C | 14 ppm/°C | Matched to copper |
| CTE (Z-axis) | -55°C to +288°C | 46 ppm/°C | Reliable PTH under thermal stress |
| Thermal Conductivity | 80°C | 0.71 W/(m·K) | Good heat dissipation |
| Tg (TMA) | – | >280°C | Withstands high-temperature processing |
| Td | TGA | 425°C | Excellent thermal stability |
| Moisture Absorption | 48 hrs immersion, 50°C | 0.06% | Excellent for humid environments |
| Density | 23°C | 1.79 g/cm³ | Lightweight |
| Dimensional Stability | After etch + E2/150°C | <0.3 mm/m | Excellent fabrication precision |
| Flammability Rating | UL 94 | N/A (non-FR) | – |
| Lead-Free Process Compatible | – | Yes | Ready for modern assembly |
370HR Properties
| Property | Test Condition | Value | Benefit |
| Glass Transition Temperature (Tg) | DSC | 180°C | High thermal reliability |
| Decomposition Temperature (Td) | TGA @ 5% weight loss | >340°C | Excellent thermal stability |
| T260 | – | >60 minutes | Thermal stress resistance |
| T288 | – | >30 minutes | Exceptional PTH reliability |
| CTE (X-axis) | Pre-Tg | 13 ppm/°C | Matched to copper |
| CTE (Y-axis) | Pre-Tg | 14 ppm/°C | Matched to copper |
| CTE (Z-axis) | Pre-Tg | 45 ppm/°C | Reliable PTH |
| CTE (Z-axis) | Post-Tg | 230 ppm/°C | – |
| Z-axis Expansion (50-260°C) | – | 2.80% | Minimized soldering stress |
| Thermal Conductivity | ASTM D5930 | 0.4 W/(m·K) | Basic heat dissipation |
| Dielectric Constant (εr) | 100 MHz | 4.24 | Predictable impedance |
| Dielectric Constant (εr) | 1 GHz | 4.17 | Stable across frequency |
| Dissipation Factor (Df) | 100 MHz | 0.015 | Moderate loss |
| Dissipation Factor (Df) | 1 GHz | 0.0161 | Moderate loss |
| Volume Resistivity | After moisture resistance | 3.0×10⁸ MΩ·cm | Good insulation |
| Surface Resistivity | After moisture resistance | 3.0×10⁶ MΩ | Clean signal integrity |
| Electrical Strength | – | 54 kV/mm (1350 V/mil) | High voltage withstand |
| Arc Resistance | – | >115 seconds | Arc withstand capability |
| Moisture Absorption | – | 0.15% | Low moisture uptake |
| Copper Peel Strength | Low profile foil | 1.14 N/mm (6.5 lb/in) | Reliable copper adhesion |
| Flammability Rating | UL 94 | V-0 | Fire safety compliant |
| Max Operating Temperature | UL Certified | 130°C | – |
PCB Stackup & Construction
Via Structures:
Blind vias L1-L2 – connecting top layer to second layer
Blind vias L9-L10 – connecting bottom layer to ninth layer
Blind vias L7-L10 – deeper blind connection from bottom side
Resin-plugged vias – filled and planarized for enhanced reliability
Impedance Control:
Top layer: 12.2 mil trace width for 50Ω single-ended
Layer 3: 3.5 mil trace width with 5.5 mil spacing for 80Ω differential pair
Surface Finish: Immersion Gold (135%-150%)
The Immersion Gold finish offers excellent characteristics for high-reliability, fine-pitch applications:
| Advantage | Description |
| Flat surface | Ideal for fine-pitch components and SMT assembly |
| Excellent solderability | Consistent, repeatable solder joints |
| Superior corrosion resistance | Long shelf life and environmental protection |
| Multiple reflow cycles | Supports lead-free soldering processes |
| Gold thickness 135%-150% | Enhanced durability for demanding applications |
| Cost-effective | Widely available, industry-standard finish |
Typical Applications
Thanks to the hybrid construction combining RO4003C's high-frequency performance with 370HR's thermal reliability, this PCB is ideally suited for:
Key Benefits Summary
| Benefit | Description |
| Hybrid construction | Optimized cost/performance – high-frequency RO4003C on outer layers, cost-effective 370HR internally |
| Low loss at high frequencies | RO4003C provides excellent signal integrity up to 40 GHz |
| High thermal reliability | 370HR offers Tg >280°C (RO4003C) and Tg 180°C (370HR) |
| Superior PTH reliability | Low Z-axis CTE in both materials |
| FR-4 compatible processing | Both materials can be processed using standard FR-4 fabrication techniques |
| Sequential lamination capable | 370HR is proven best-in-class for sequential lamination designs |
| Impedance controlled | 50Ω and 80Ω structures implemented on critical layers |
| Blind and resin-plugged vias | Enables higher routing density and improved reliability |
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
