|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
4-Layer Hybrid High-Frequency PCB with RO3210™
1. Product Overview
This product is a 4-layer hybrid printed circuit board engineered for demanding RF and microwave applications requiring high dielectric constant (Dk ≈ 10.2) and excellent mechanical stability. The design uses a symmetric stack-up consisting of two outer layers of Rogers RO3210™ (ceramic-filled, woven fiberglass-reinforced PTFE) bonded with a RO4450F™ prepreg. The board measures 95 mm x 98 mm and is supplied as a single piece.
The structure incorporates controlled depth grooves from the top layer to inner layer 1, as well as blind vias (layers 1–3) to enable compact, high-density RF routing. Both top and bottom layers feature green solder masks, with white lettering on the top side only. The surface finish is a combination of silver plating and gold plating to accommodate both solderability and wire bonding requirements.
2. Product Specifications
| Parameter | Specification |
| Board Dimensions | 95 mm x 98 mm (1 piece) |
| Layer Count | 4 layers (symmetric hybrid stack-up) |
| High-Frequency Material | Rogers RO3210™ (ceramic-filled, woven glass-reinforced PTFE) |
| Bonding Material | Rogers RO4450F™ prepreg |
| Finished Board Thickness | 1.321 mm (bonding thickness) |
| Outer Layer Copper (Finished) | 1 oz |
| Inner Layer Copper (Finished) | 0.5 oz |
| Top Solder Mask | Green, with white lettering |
| Bottom Solder Mask | Green, no lettering |
| Surface Finish | Silver plating + Gold plating |
| Special Features | Controlled depth groove (TOP → Inner Layer 1); Blind vias (Layer 1 → Layer 3) |
Stack-Up Structure
3. RO3210™ Laminate: Introduction & Key Properties
RO3210™ is a ceramic-filled PTFE laminate reinforced with woven fiberglass, belonging to Rogers Corporation’s RO3200™ Series. This series was developed as an extension of the RO3000® Series with one distinguishing characteristic: improved mechanical stability.
According to the RO3210 datasheet:
RO3200 series laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate.
This makes RO3210 ideal for designs that require both high Dk (≈10.2) and dimensional stability under thermal and mechanical stress.
RO3210™ Datasheet Summary
| Property | RO3210 Value | Units | Test Condition |
| Dielectric Constant (process) | 10.2 ± 0.50 | — | 10 GHz, 23°C |
| Dielectric Constant (design) | 10.8 | — | 8–40 GHz |
| Dissipation Factor | 0.0027 | — | 10 GHz, 23°C |
| Thermal Coefficient of εr | -459 | ppm/°C | 10 GHz, 0–100°C |
| CTE (X/Y) | 13 | ppm/°C | -55 to 288°C |
| CTE (Z) | 34 | ppm/°C | -55 to 288°C |
| Thermal Conductivity | 0.81 | W/(m·K) | 80°C |
| Copper Peel Strength (1 oz) | 11 | lbs/in | After solder float |
| Dimensional Stability | 0.8 | mm/m | COND A |
| Water Absorption | <0.1 | % | D24/23 |
| Density | 3 | g/cm³ | — |
| Flammability | V-0 | — | UL 94 |
| Lead-Free Process Compatible | Yes | — | — |
Key Advantages of RO3210:
High Dk (10.2 ± 0.50) – Enables circuit miniaturization for lower-frequency RF designs (e.g., 1–10 GHz).
Woven glass reinforcement – Provides superior mechanical rigidity compared to non-woven PTFE laminates.
Good dimensional stability (0.8 mm/m) – Reduces registration errors during multilayer lamination.
Compatible with standard PTFE fabrication processes – Minor modifications as described in Rogers’ fabrication guidelines.
V-0 flammability rating – Suitable for commercial and industrial applications.
4. Application Areas
The combination of RO3210’s high Dk and mechanical stability makes this PCB suitable for:
Phased array radars, electronic warfare systems, satellite downconverters,
Base station filters, power dividers, couplers, and patch antennas
Note: While RO3210 is suitable for many RF applications, its dissipation factor (0.0027) is higher than RO3003 (0.0010). For extremely loss-sensitive millimeter-wave designs (≥30 GHz), RO3003 or RO3006 may be preferred.
5. Special Fabrication Features
This PCB includes two advanced features to support high-density RF routing:
5.1 Controlled Depth Groove (TOP → Inner Layer 1)
Purpose: Allows precise routing or shielding integration without penetrating the entire board.
Benefit: Enables co-planar waveguide (CPW) structures or partial cutouts for component mounting.
5.2 Blind Vias (Layer 1 → Layer 3)
Purpose: Electrical connection from top layer directly to layer 3, bypassing layer 2.
Benefit: Reduces parasitic inductance and enables compact RF signal routing.
Fabrication Notes for RO3210 (per Rogers’ Guidelines)
| Process Step | Recommendation |
| Drilling | Carbide or diamond-coated bits; entry/exit supports to prevent smearing |
| Desmear / Hole Preparation | Plasma etching or sodium naphthalene treatment required for PTFE surface activation |
| Lamination (RO4450F) | Follow RO4450F datasheet for temperature and pressure profiles |
| Baking | Pre-bake at 120–150°C for 1–2 hours to remove moisture |
| Solder Mask | Use high-adhesion, PTFE-compatible inks (e.g., Taiyo PSR-4000 series) |
| Surface Finish | Silver + gold plating – ensure compatibility with PTFE materials |
6. Summary
This 4-layer hybrid PCB leverages the high dielectric constant (10.2) and woven-glass mechanical stability of RO3210™ on all four layers, bonded with RO4450F™ prepreg. The inclusion of controlled depth grooves and blind vias (1–3) enables advanced RF routing in a compact 95 mm x 98 mm footprint. With green solder masks (white lettering on top), and a silver + gold surface finish, this board is ready for demanding aerospace, defense, automotive radar, and telecommunications applications.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
4-Layer Hybrid High-Frequency PCB with RO3210™
1. Product Overview
This product is a 4-layer hybrid printed circuit board engineered for demanding RF and microwave applications requiring high dielectric constant (Dk ≈ 10.2) and excellent mechanical stability. The design uses a symmetric stack-up consisting of two outer layers of Rogers RO3210™ (ceramic-filled, woven fiberglass-reinforced PTFE) bonded with a RO4450F™ prepreg. The board measures 95 mm x 98 mm and is supplied as a single piece.
The structure incorporates controlled depth grooves from the top layer to inner layer 1, as well as blind vias (layers 1–3) to enable compact, high-density RF routing. Both top and bottom layers feature green solder masks, with white lettering on the top side only. The surface finish is a combination of silver plating and gold plating to accommodate both solderability and wire bonding requirements.
2. Product Specifications
| Parameter | Specification |
| Board Dimensions | 95 mm x 98 mm (1 piece) |
| Layer Count | 4 layers (symmetric hybrid stack-up) |
| High-Frequency Material | Rogers RO3210™ (ceramic-filled, woven glass-reinforced PTFE) |
| Bonding Material | Rogers RO4450F™ prepreg |
| Finished Board Thickness | 1.321 mm (bonding thickness) |
| Outer Layer Copper (Finished) | 1 oz |
| Inner Layer Copper (Finished) | 0.5 oz |
| Top Solder Mask | Green, with white lettering |
| Bottom Solder Mask | Green, no lettering |
| Surface Finish | Silver plating + Gold plating |
| Special Features | Controlled depth groove (TOP → Inner Layer 1); Blind vias (Layer 1 → Layer 3) |
Stack-Up Structure
3. RO3210™ Laminate: Introduction & Key Properties
RO3210™ is a ceramic-filled PTFE laminate reinforced with woven fiberglass, belonging to Rogers Corporation’s RO3200™ Series. This series was developed as an extension of the RO3000® Series with one distinguishing characteristic: improved mechanical stability.
According to the RO3210 datasheet:
RO3200 series laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate.
This makes RO3210 ideal for designs that require both high Dk (≈10.2) and dimensional stability under thermal and mechanical stress.
RO3210™ Datasheet Summary
| Property | RO3210 Value | Units | Test Condition |
| Dielectric Constant (process) | 10.2 ± 0.50 | — | 10 GHz, 23°C |
| Dielectric Constant (design) | 10.8 | — | 8–40 GHz |
| Dissipation Factor | 0.0027 | — | 10 GHz, 23°C |
| Thermal Coefficient of εr | -459 | ppm/°C | 10 GHz, 0–100°C |
| CTE (X/Y) | 13 | ppm/°C | -55 to 288°C |
| CTE (Z) | 34 | ppm/°C | -55 to 288°C |
| Thermal Conductivity | 0.81 | W/(m·K) | 80°C |
| Copper Peel Strength (1 oz) | 11 | lbs/in | After solder float |
| Dimensional Stability | 0.8 | mm/m | COND A |
| Water Absorption | <0.1 | % | D24/23 |
| Density | 3 | g/cm³ | — |
| Flammability | V-0 | — | UL 94 |
| Lead-Free Process Compatible | Yes | — | — |
Key Advantages of RO3210:
High Dk (10.2 ± 0.50) – Enables circuit miniaturization for lower-frequency RF designs (e.g., 1–10 GHz).
Woven glass reinforcement – Provides superior mechanical rigidity compared to non-woven PTFE laminates.
Good dimensional stability (0.8 mm/m) – Reduces registration errors during multilayer lamination.
Compatible with standard PTFE fabrication processes – Minor modifications as described in Rogers’ fabrication guidelines.
V-0 flammability rating – Suitable for commercial and industrial applications.
4. Application Areas
The combination of RO3210’s high Dk and mechanical stability makes this PCB suitable for:
Phased array radars, electronic warfare systems, satellite downconverters,
Base station filters, power dividers, couplers, and patch antennas
Note: While RO3210 is suitable for many RF applications, its dissipation factor (0.0027) is higher than RO3003 (0.0010). For extremely loss-sensitive millimeter-wave designs (≥30 GHz), RO3003 or RO3006 may be preferred.
5. Special Fabrication Features
This PCB includes two advanced features to support high-density RF routing:
5.1 Controlled Depth Groove (TOP → Inner Layer 1)
Purpose: Allows precise routing or shielding integration without penetrating the entire board.
Benefit: Enables co-planar waveguide (CPW) structures or partial cutouts for component mounting.
5.2 Blind Vias (Layer 1 → Layer 3)
Purpose: Electrical connection from top layer directly to layer 3, bypassing layer 2.
Benefit: Reduces parasitic inductance and enables compact RF signal routing.
Fabrication Notes for RO3210 (per Rogers’ Guidelines)
| Process Step | Recommendation |
| Drilling | Carbide or diamond-coated bits; entry/exit supports to prevent smearing |
| Desmear / Hole Preparation | Plasma etching or sodium naphthalene treatment required for PTFE surface activation |
| Lamination (RO4450F) | Follow RO4450F datasheet for temperature and pressure profiles |
| Baking | Pre-bake at 120–150°C for 1–2 hours to remove moisture |
| Solder Mask | Use high-adhesion, PTFE-compatible inks (e.g., Taiyo PSR-4000 series) |
| Surface Finish | Silver + gold plating – ensure compatibility with PTFE materials |
6. Summary
This 4-layer hybrid PCB leverages the high dielectric constant (10.2) and woven-glass mechanical stability of RO3210™ on all four layers, bonded with RO4450F™ prepreg. The inclusion of controlled depth grooves and blind vias (1–3) enables advanced RF routing in a compact 95 mm x 98 mm footprint. With green solder masks (white lettering on top), and a silver + gold surface finish, this board is ready for demanding aerospace, defense, automotive radar, and telecommunications applications.
