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| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
2-Layer RT/duroid® 6006 PCB | 10mil Core | Immersion Silver Finish
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RT/duroid® 6006 high-frequency laminate. As a ceramic-PTFE composite specifically engineered for electronic and microwave circuit applications requiring a high dielectric constant, this material enables significant circuit size reduction while maintaining excellent electrical performance.
The board is supplied as two types (2 pieces) with dimensions of 134.8mm x 78.65mm per piece, dimensional tolerance of ±0.15mm. Finished board thickness is 0.4mm (including 10mil core + 2 x 35μm copper). Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.
This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The Immersion Silver surface finish provides excellent solderability, low contact resistance, and superior RF performance, making it particularly suitable for high-frequency and RF applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | Rogers RT/duroid® 6006 (Ceramic-PTFE composite) |
| Board Dimensions | 134.8mm x 78.65mm (2 types = 2 PCBs) ±0.15mm |
| Finished Thickness | 0.4mm |
| Core Thickness | 10mil (0.254mm) |
| Min. Trace / Space | 5 / 6 mils |
| Min. Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 46 / 64 / 41 / 2 |
Material Advantages: RT/duroid® 6006
The RT/duroid® 6006 microwave laminates from Rogers Corporation are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. With a Dk value of 6.15, these laminates enable significant circuit size reduction while maintaining excellent high-frequency performance.
Key material highlights:
Ceramic-PTFE composite construction provides a unique balance of electrical and mechanical properties
Tight dielectric constant and thickness control ensures repeatable circuit performance across production lots
Low moisture absorption (0.05%) maintains stable electrical properties in humid environments
Excellent thermal mechanical stability supports reliable operation across a wide temperature range
High thermal decomposition temperature (Td > 500°C) offers exceptional thermal stability
The material is supplied clad both sides with electrodeposited copper foil. The combination of high Dk and low loss makes RT/duroid 6006 ideal for operating at X-band frequencies and below. Standard dielectric thicknesses include 0.010", 0.025", 0.050", 0.075", and 0.100", with additional thicknesses available upon request.
RT/duroid® 6006 Material Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (εr) Process | 10 GHz / 23°C | 6.15 ±0.15 | High Dk enables circuit size reduction |
| Dielectric Constant (εr) Design | 8 GHz to 40 GHz | 6.45 | Accurate design for broadband applications |
| Dissipation Factor (tan δ) | 10 GHz / 23°C | 0.0027 | Low loss, ideal for X-band and below |
| TCDk (Thermal Coefficient of εr) | -50°C to +170°C | -410 ppm/°C | Predictable performance across temperature |
| Surface Resistivity | COND A | 7 × 10⁷ MΩ | Clean signal integrity |
| Volume Resistivity | COND A | 2 × 10⁷ MΩ·cm | High insulation resistance |
| CTE (X-axis) | -55°C to +288°C | 47 ppm/°C | Dimensional stability |
| CTE (Y-axis) | -55°C to +288°C | 34 ppm/°C | Dimensional stability |
| CTE (Z-axis) | -55°C to +288°C | 117 ppm/°C | Reliable PTH performance |
| Thermal Conductivity | 80°C | 0.49 W/(m·K) | Basic heat dissipation |
| Moisture Absorption | D48/50°C, 0.050" thick | 0.05% | Stable in humid environments |
| Density | – | 2.7 g/cm³ | High ceramic content |
| Td (Thermal Decomposition) | TGA | >500°C | Excellent thermal stability |
| Copper Peel Strength | After solder float | 2.5 N/mm (14.3 pli) | Reliable copper adhesion |
| Flammability Rating | UL 94 | V-0 | Fire safety compliant |
| Lead-Free Process Compatible | – | Yes | Ready for modern assembly |
PCB Stackup & Construction
The board features a thin, high-performance 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper
Dielectric Core: Rogers RT/duroid® 6006 – 10mil (0.254mm)
Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper
Total Finished Thickness: 0.4mm
Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 46 components, 64 total pads (26 thru-hole, 38 top SMT), 41 vias, and 2 nets.
Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.
Typical Applications
Thanks to its high Dk (6.15), low loss, and stable electrical properties, this PCB is ideally suited for:
Patch antennas
Satellite communications systems
Power amplifiers
Aircraft collision avoidance systems
Ground radar warning systems
Electronic and microwave circuits requiring high dielectric constant
Available Configurations
RT/duroid 6006 laminates are available with standard dielectric thicknesses of 0.010", 0.025", 0.050", 0.075", and 0.100" (0.254, 0.635, 1.270, 1.905, 2.54 mm). Copper cladding options range from ½ oz. to 2 oz./ft² (18 to 70 μm), including standard and reverse-treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may also be specified. Standard panel sizes include 10"x10", 10"x20", and 18"x12", with additional sizes available upon request.
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | パッキング |
| 配達期間: | 2～10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000個 |
2-Layer RT/duroid® 6006 PCB | 10mil Core | Immersion Silver Finish
Product Overview
We are pleased to present this newly customized 2-layer rigid PCB built on Rogers RT/duroid® 6006 high-frequency laminate. As a ceramic-PTFE composite specifically engineered for electronic and microwave circuit applications requiring a high dielectric constant, this material enables significant circuit size reduction while maintaining excellent electrical performance.
The board is supplied as two types (2 pieces) with dimensions of 134.8mm x 78.65mm per piece, dimensional tolerance of ±0.15mm. Finished board thickness is 0.4mm (including 10mil core + 2 x 35μm copper). Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. No blind vias are used in this construction.
This design features no solder mask and no silkscreen on both sides—an intentional choice to eliminate parasitic losses and ensure optimal RF performance. The Immersion Silver surface finish provides excellent solderability, low contact resistance, and superior RF performance, making it particularly suitable for high-frequency and RF applications. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.
PCB General Specifications
| Parameter | Detail |
| Layer Count | 2-Layer Rigid |
| Base Material | Rogers RT/duroid® 6006 (Ceramic-PTFE composite) |
| Board Dimensions | 134.8mm x 78.65mm (2 types = 2 PCBs) ±0.15mm |
| Finished Thickness | 0.4mm |
| Core Thickness | 10mil (0.254mm) |
| Min. Trace / Space | 5 / 6 mils |
| Min. Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Cu Weight | 1 oz (1.4 mils / 35μm) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Electrical Test | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-2 |
| Availability | Worldwide |
| Components / Pads / Vias / Nets | 46 / 64 / 41 / 2 |
Material Advantages: RT/duroid® 6006
The RT/duroid® 6006 microwave laminates from Rogers Corporation are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. With a Dk value of 6.15, these laminates enable significant circuit size reduction while maintaining excellent high-frequency performance.
Key material highlights:
Ceramic-PTFE composite construction provides a unique balance of electrical and mechanical properties
Tight dielectric constant and thickness control ensures repeatable circuit performance across production lots
Low moisture absorption (0.05%) maintains stable electrical properties in humid environments
Excellent thermal mechanical stability supports reliable operation across a wide temperature range
High thermal decomposition temperature (Td > 500°C) offers exceptional thermal stability
The material is supplied clad both sides with electrodeposited copper foil. The combination of high Dk and low loss makes RT/duroid 6006 ideal for operating at X-band frequencies and below. Standard dielectric thicknesses include 0.010", 0.025", 0.050", 0.075", and 0.100", with additional thicknesses available upon request.
RT/duroid® 6006 Material Properties
| Property | Test Condition | Value | Benefit |
| Dielectric Constant (εr) Process | 10 GHz / 23°C | 6.15 ±0.15 | High Dk enables circuit size reduction |
| Dielectric Constant (εr) Design | 8 GHz to 40 GHz | 6.45 | Accurate design for broadband applications |
| Dissipation Factor (tan δ) | 10 GHz / 23°C | 0.0027 | Low loss, ideal for X-band and below |
| TCDk (Thermal Coefficient of εr) | -50°C to +170°C | -410 ppm/°C | Predictable performance across temperature |
| Surface Resistivity | COND A | 7 × 10⁷ MΩ | Clean signal integrity |
| Volume Resistivity | COND A | 2 × 10⁷ MΩ·cm | High insulation resistance |
| CTE (X-axis) | -55°C to +288°C | 47 ppm/°C | Dimensional stability |
| CTE (Y-axis) | -55°C to +288°C | 34 ppm/°C | Dimensional stability |
| CTE (Z-axis) | -55°C to +288°C | 117 ppm/°C | Reliable PTH performance |
| Thermal Conductivity | 80°C | 0.49 W/(m·K) | Basic heat dissipation |
| Moisture Absorption | D48/50°C, 0.050" thick | 0.05% | Stable in humid environments |
| Density | – | 2.7 g/cm³ | High ceramic content |
| Td (Thermal Decomposition) | TGA | >500°C | Excellent thermal stability |
| Copper Peel Strength | After solder float | 2.5 N/mm (14.3 pli) | Reliable copper adhesion |
| Flammability Rating | UL 94 | V-0 | Fire safety compliant |
| Lead-Free Process Compatible | – | Yes | Ready for modern assembly |
PCB Stackup & Construction
The board features a thin, high-performance 2-layer stackup:
Top Copper (Layer 1): 1 oz (35μm) – Electrodeposited copper
Dielectric Core: Rogers RT/duroid® 6006 – 10mil (0.254mm)
Bottom Copper (Layer 2): 1 oz (35μm) – Electrodeposited copper
Total Finished Thickness: 0.4mm
Minimum trace and space are 5/6 mils, with a minimum finished hole size of 0.3mm. Via plating thickness is 20μm, and no blind vias are used. The design supports 46 components, 64 total pads (26 thru-hole, 38 top SMT), 41 vias, and 2 nets.
Both solder mask and silkscreen are omitted on both sides, preserving the bare dielectric surface for optimal RF performance and minimizing signal loss—critical for high-frequency microwave applications.
Typical Applications
Thanks to its high Dk (6.15), low loss, and stable electrical properties, this PCB is ideally suited for:
Patch antennas
Satellite communications systems
Power amplifiers
Aircraft collision avoidance systems
Ground radar warning systems
Electronic and microwave circuits requiring high dielectric constant
Available Configurations
RT/duroid 6006 laminates are available with standard dielectric thicknesses of 0.010", 0.025", 0.050", 0.075", and 0.100" (0.254, 0.635, 1.270, 1.905, 2.54 mm). Copper cladding options range from ½ oz. to 2 oz./ft² (18 to 70 μm), including standard and reverse-treated electrodeposited copper foil. Thick aluminum, brass, or copper plate on one side may also be specified. Standard panel sizes include 10"x10", 10"x20", and 18"x12", with additional sizes available upon request.
All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.
