RO3210 4-layer PCB built on 1.22mm Thickness substrates with Immersion Gold Finish

4-Layer PCB with RO3210, 1.24mm Thickness, and Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of the 4-Layer PCB

This 4-layer rigid PCB is built with Rogers RO3210, a high-frequency circuit material that combines ceramic-filled laminates with woven fiberglass reinforcement, offering improved mechanical stability and uniform electrical performance. The smooth surface of RO3210 is ideal for finer line etching tolerances, ensuring reliability in complex designs.

The immersion gold (ENIG) surface finish provides excellent solderability and long-term corrosion resistance. While no solder mask or silkscreen is applied, the board is designed with precision and tested to IPC-Class-2 standards, guaranteeing quality and reliability.

2. PCB Construction Details

3. PCB Stackup

The 4-layer stackup is engineered for high-frequency RF designs, balancing performance and thermal management. Here’s the structure:

4. Features of Rogers RO3210

• Dielectric Constant (Dk): 10.2 ± 0.5 at 10 GHz, delivering stable signal propagation.
• Dissipation Factor (Df): 0.0027 at 10 GHz, minimizing signal loss.
• Decomposition Temperature (Td): 500°C, ensuring reliability in high-heat environments.
• Thermal Conductivity: 0.81W/mK, providing effective heat dissipation.
• CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C. Y-axis: 13 ppm/°C. Z-axis: 34 ppm/°C, ensuring dimensional stability and plated-through hole reliability.
• Flammability Rating: UL 94 V-0, meeting stringent safety standards.
• Smooth Surface: Ideal for fine line etching tolerances, enabling precise designs.

5. Benefits of RO3210 Material

Mechanical Stability: Woven glass reinforcement improves rigidity and handling, ensuring reliable assembly.

Dimensional Stability: Low CTE provides compatibility with copper and hybrid designs, ensuring high production yields.

High Dielectric Performance: Uniform electrical properties make it suitable for multi-layer, high-frequency structures.

Finer Line Etching: Smooth surface allows for tighter tolerances in complex designs.

Cost-Effective Fabrication: Compatible with standard PTFE processing techniques, reducing production costs.

6. Applications of the 4-Layer PCB

Automotive Collision Avoidance Systems: Ensures stable signal performance in safety-critical systems.

Automotive GPS Antennas: Provides precision signal transmission for satellite navigation.

Wireless Telecommunications Systems: Ideal for base station infrastructure and broadband wireless communication.

Microstrip Patch Antennas: Suitable for compact, high-performance wireless communication designs.

Direct Broadcast Satellites: Ensures reliability in satellite communication systems.

Datalink and Power Backplanes: Suitable for efficient data transmission and power management systems.

Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in manufacturing high-quality PCBs for RF and microwave applications. Our 4-layer PCB with Rogers RO3210 material combines cutting-edge materials and precise manufacturing techniques to deliver reliable performance for your high-frequency designs.

Why Work With Us?

Global Availability: We deliver worldwide and provide excellent customer support.

High Standards: All PCBs are tested to IPC-Class-2 standards for reliable performance.

Customized Solutions: We work closely with you to meet your specific requirements.

If you’re looking for a trusted partner to bring your innovative designs to life, feel free to contact me at sales30@bichengpcb.com. Let’s collaborate to make your next project a success!