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RT/duroid 5870 Copper-Clad Laminate 457mm x 305mm with 0.127mm 0.252mm 0.508mm 0.787mm usign in Low-loss filters and antenna

RT/duroid 5870 Copper-Clad Laminate 457mm x 305mm with 0.127mm 0.252mm 0.508mm 0.787mm usign in Low-loss filters and antenna

MOQ: 1個
価格: 7.99 USD/PCS
標準パッケージ: パッキング
配達期間: 2〜10営業日
決済方法: T/T、ペイパル
供給能力: 50000個
詳細情報
起源の場所
中国
ブランド名
Rogers
証明
ISO9001
モデル番号
RT/Duroid 5870
最小注文数量:
1個
価格:
7.99 USD/PCS
パッケージの詳細:
パッキング
受渡し時間:
2〜10営業日
支払条件:
T/T、ペイパル
供給の能力:
50000個
製品説明

RT/duroid® 5870 Copper-Clad Laminate: Precision and Performance for Demanding High-Frequency Designs

 

 

As your trusted supplier, we are pleased to offer the exceptional RT/duroid® 5870, a premier high-frequency laminate from Rogers Corporation engineered for the most critical RF and microwave applications. This material represents the gold standard for designers who require a perfect balance of stable electrical properties, mechanical integrity, and superior processability in stripline and microstrip circuits.

 

RT/duroid 5870 Copper-Clad Laminate 457mm x 305mm with 0.127mm 0.252mm 0.508mm 0.787mm usign in Low-loss filters and  antenna 0

 

Unmatched Electrical Consistency and Low Loss
The core advantage of RT/duroid 5870 lies in its construction. It is a glass microfiber-reinforced PTFE composite, where the randomly oriented microfibers create exceptional uniformity in the dielectric constant (Dk) across the entire panel. This results in highly predictable performance, batch after batch. The laminate features a stable dielectric constant of 2.33 ± 0.02 (at 10 GHz) and an exceptionally low dissipation factor (Df) of 0.0012 at the same frequency. This ultra-low loss characteristic ensures minimal signal attenuation, making it an ideal choice for sensitive, high-performance applications operating well into the Ku-band and beyond. Its thermal coefficient of Dk is a remarkably low -115 ppm/°C, guaranteeing stable electrical behavior across a wide operational temperature range (-50°C to +150°C).

 

PROPERTY TYPICAL VALUES DIRECTION UNITS[3] CONDITION TEST METHOD
RT/duroid 5870 RT/duroid 5880
[1]Dielectric Constant, εr Process 2.33
2.33 ± 0.02 spec.
2.2
2.20 ± 0.02 spec.
Z
Z
N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
[4]Dielectric Constant, εr Design 2.33 2.2 Z N/A 8 GHz - 40 GHz Differential Phase Length
Method
Dissipation Factor, tan δ 0.0005
0.0012
0.0004
0.0009
Z
Z
N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650, 2.5.5.3 10 GHz IPC-TM-2.5.5.5
Thermal Coefficient of εr -115 -125 Z ppm/°C -50 - 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity 2 X 107 2 X 107 Z Mohm cm C96/35/90 ASTM D257
Surface Resistivity 2 X 107 3 X 107 Z Mohm C/96/35/90 ASTM D257
Specific Heat 0.96 (0.23) 0.96 (0.23) N/A J/g/K
(cal/g/C)
N/A Calculated
  Test at 23 °C Test at 100°C Test at 23 °C Test at 100°C N/A MPa (kpsi) A ASTM D638
Tensile Modulus
1300 (189) 490 (71) 1070 (156) 450 (65) X
1280 (185) 430 (63) 860 (125) 380 (55) Y
ultimate stress 50 (7.3) 34 (4.8) 29 (4.2) 20 (2.9) X
42 (6.1) 34 (4.8) 27 (3.9) 18 (2.6) Y
ultimate strain 9.8 8.7 6.0 7.2 X %
9.8 8.6 4.9 5.8 Y
Compressive Modulus 1210 (176) 680 (99) 710 (103) 500 (73) X MPa (kpsi) A ASTM D695
1360 (198) 860 (125) 710 (103) 500 (73) Y
803 (120) 520 (76) 940 (136) 670 (97) Z
ultimate stress 30 (4.4) 23 (3.4) 27 (3.9) 22 (3.2) X
37 (5.3) 25 (3.7) 29 (5.3) 21 (3.1) Y
54 (7.8) 37 (5.3) 52 (7.5) 43 (6.3) Z
ultimate strain 4.0 4.3 8.5 8.4 X %
3.3 3.3 7.7 7.8 Y
8.7 8.5 12.5 17.6 Z
Moisture Absorption 0.02 0.02 N/A % .062” (1.6mm) ASTM D570
D48/50
Thermal Conductivity 0.22 0.2 Z W/m/K 80°C ASTM C518
Coefficient of
Thermal Expansion
22 31 X ppm/°C 0-100°C IPC-TM-650, 2.4.41
28 48 Y
173 237 Z
Td 500 500 N/A °CTGA N/A ASTM D3850
Density 2.2 2.2 N/A gm/cm3 N/A ASTM D792
Copper Peel 27.2 (4.8) 31.2 (5.5) N/A pli (N/mm) 1 oz (35mm) EDC IPC-TM-650 2.4.8
foil
after solder float
Flammability V-0 V-0 N/A N/A N/A UL94
Lead-Free Process Compatible Yes Yes N/A N/A N/A N/A

 

Robust Mechanical Properties for Reliable Fabrication
Beyond its electrical excellence, RT/duroid 5870 is designed for reliable manufacturing. It is easily machined, cut, and sheared without fraying, and exhibits excellent resistance to the solvents and reagents used in standard PCB etching and plating processes. With a very low moisture absorption of only 0.02%, it maintains dimensional and electrical stability in humid environments. The material provides strong copper peel strength (>4.8 pli for 1 oz EDC) for reliable plated through-holes and surface mounts, and it carries a UL 94 V-0 flammability rating, meeting stringent safety requirements. It is fully compatible with lead-free assembly processes.

 

 

Flexible Standard Configurations to Meet Your Needs
We supply RT/duroid 5870 in a variety of standard configurations for your design flexibility:

 

Standard Thicknesses: 0.005" (0.127mm), 0.010" (0.252mm), 0.020" (0.508mm), 0.031" (0.787mm), and 0.062" (1.575mm), all with tight tolerances. Numerous additional thicknesses from 0.0035" to 0.375" are available.

 

Standard Panel Sizes: 18" x 12" (457mm x 305mm) and 18" x 24" (457mm x 610mm).

 

Standard Cladding Options: Choose from electrodeposited copper foil (½ oz or 1 oz) for general use, or rolled copper foil for applications demanding the lowest possible conductor loss at extremely high frequencies. Cladding with other metals (e.g., aluminum) or unclad material is also available.

 

 

Ideal Applications

  1. Aerospace and defense radar systems
  2. Satellite communications and telemetry
  3. High-performance point-to-point radio links
  4. Critical test and measurement equipment
  5. Low-loss filters and phase shifters

 

 

For projects where signal integrity, loss minimization, and batch-to-batch consistency are non-negotiable, RT/duroid 5870 delivers proven performance. Contact our sales engineering team today to discuss your specific requirements, request samples, or place an order. We are here to provide the technical support and material solutions that ensure your high-frequency design succeeds.

 

製品
商品の詳細
RT/duroid 5870 Copper-Clad Laminate 457mm x 305mm with 0.127mm 0.252mm 0.508mm 0.787mm usign in Low-loss filters and antenna
MOQ: 1個
価格: 7.99 USD/PCS
標準パッケージ: パッキング
配達期間: 2〜10営業日
決済方法: T/T、ペイパル
供給能力: 50000個
詳細情報
起源の場所
中国
ブランド名
Rogers
証明
ISO9001
モデル番号
RT/Duroid 5870
最小注文数量:
1個
価格:
7.99 USD/PCS
パッケージの詳細:
パッキング
受渡し時間:
2〜10営業日
支払条件:
T/T、ペイパル
供給の能力:
50000個
製品説明

RT/duroid® 5870 Copper-Clad Laminate: Precision and Performance for Demanding High-Frequency Designs

 

 

As your trusted supplier, we are pleased to offer the exceptional RT/duroid® 5870, a premier high-frequency laminate from Rogers Corporation engineered for the most critical RF and microwave applications. This material represents the gold standard for designers who require a perfect balance of stable electrical properties, mechanical integrity, and superior processability in stripline and microstrip circuits.

 

RT/duroid 5870 Copper-Clad Laminate 457mm x 305mm with 0.127mm 0.252mm 0.508mm 0.787mm usign in Low-loss filters and  antenna 0

 

Unmatched Electrical Consistency and Low Loss
The core advantage of RT/duroid 5870 lies in its construction. It is a glass microfiber-reinforced PTFE composite, where the randomly oriented microfibers create exceptional uniformity in the dielectric constant (Dk) across the entire panel. This results in highly predictable performance, batch after batch. The laminate features a stable dielectric constant of 2.33 ± 0.02 (at 10 GHz) and an exceptionally low dissipation factor (Df) of 0.0012 at the same frequency. This ultra-low loss characteristic ensures minimal signal attenuation, making it an ideal choice for sensitive, high-performance applications operating well into the Ku-band and beyond. Its thermal coefficient of Dk is a remarkably low -115 ppm/°C, guaranteeing stable electrical behavior across a wide operational temperature range (-50°C to +150°C).

 

PROPERTY TYPICAL VALUES DIRECTION UNITS[3] CONDITION TEST METHOD
RT/duroid 5870 RT/duroid 5880
[1]Dielectric Constant, εr Process 2.33
2.33 ± 0.02 spec.
2.2
2.20 ± 0.02 spec.
Z
Z
N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
[4]Dielectric Constant, εr Design 2.33 2.2 Z N/A 8 GHz - 40 GHz Differential Phase Length
Method
Dissipation Factor, tan δ 0.0005
0.0012
0.0004
0.0009
Z
Z
N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650, 2.5.5.3 10 GHz IPC-TM-2.5.5.5
Thermal Coefficient of εr -115 -125 Z ppm/°C -50 - 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity 2 X 107 2 X 107 Z Mohm cm C96/35/90 ASTM D257
Surface Resistivity 2 X 107 3 X 107 Z Mohm C/96/35/90 ASTM D257
Specific Heat 0.96 (0.23) 0.96 (0.23) N/A J/g/K
(cal/g/C)
N/A Calculated
  Test at 23 °C Test at 100°C Test at 23 °C Test at 100°C N/A MPa (kpsi) A ASTM D638
Tensile Modulus
1300 (189) 490 (71) 1070 (156) 450 (65) X
1280 (185) 430 (63) 860 (125) 380 (55) Y
ultimate stress 50 (7.3) 34 (4.8) 29 (4.2) 20 (2.9) X
42 (6.1) 34 (4.8) 27 (3.9) 18 (2.6) Y
ultimate strain 9.8 8.7 6.0 7.2 X %
9.8 8.6 4.9 5.8 Y
Compressive Modulus 1210 (176) 680 (99) 710 (103) 500 (73) X MPa (kpsi) A ASTM D695
1360 (198) 860 (125) 710 (103) 500 (73) Y
803 (120) 520 (76) 940 (136) 670 (97) Z
ultimate stress 30 (4.4) 23 (3.4) 27 (3.9) 22 (3.2) X
37 (5.3) 25 (3.7) 29 (5.3) 21 (3.1) Y
54 (7.8) 37 (5.3) 52 (7.5) 43 (6.3) Z
ultimate strain 4.0 4.3 8.5 8.4 X %
3.3 3.3 7.7 7.8 Y
8.7 8.5 12.5 17.6 Z
Moisture Absorption 0.02 0.02 N/A % .062” (1.6mm) ASTM D570
D48/50
Thermal Conductivity 0.22 0.2 Z W/m/K 80°C ASTM C518
Coefficient of
Thermal Expansion
22 31 X ppm/°C 0-100°C IPC-TM-650, 2.4.41
28 48 Y
173 237 Z
Td 500 500 N/A °CTGA N/A ASTM D3850
Density 2.2 2.2 N/A gm/cm3 N/A ASTM D792
Copper Peel 27.2 (4.8) 31.2 (5.5) N/A pli (N/mm) 1 oz (35mm) EDC IPC-TM-650 2.4.8
foil
after solder float
Flammability V-0 V-0 N/A N/A N/A UL94
Lead-Free Process Compatible Yes Yes N/A N/A N/A N/A

 

Robust Mechanical Properties for Reliable Fabrication
Beyond its electrical excellence, RT/duroid 5870 is designed for reliable manufacturing. It is easily machined, cut, and sheared without fraying, and exhibits excellent resistance to the solvents and reagents used in standard PCB etching and plating processes. With a very low moisture absorption of only 0.02%, it maintains dimensional and electrical stability in humid environments. The material provides strong copper peel strength (>4.8 pli for 1 oz EDC) for reliable plated through-holes and surface mounts, and it carries a UL 94 V-0 flammability rating, meeting stringent safety requirements. It is fully compatible with lead-free assembly processes.

 

 

Flexible Standard Configurations to Meet Your Needs
We supply RT/duroid 5870 in a variety of standard configurations for your design flexibility:

 

Standard Thicknesses: 0.005" (0.127mm), 0.010" (0.252mm), 0.020" (0.508mm), 0.031" (0.787mm), and 0.062" (1.575mm), all with tight tolerances. Numerous additional thicknesses from 0.0035" to 0.375" are available.

 

Standard Panel Sizes: 18" x 12" (457mm x 305mm) and 18" x 24" (457mm x 610mm).

 

Standard Cladding Options: Choose from electrodeposited copper foil (½ oz or 1 oz) for general use, or rolled copper foil for applications demanding the lowest possible conductor loss at extremely high frequencies. Cladding with other metals (e.g., aluminum) or unclad material is also available.

 

 

Ideal Applications

  1. Aerospace and defense radar systems
  2. Satellite communications and telemetry
  3. High-performance point-to-point radio links
  4. Critical test and measurement equipment
  5. Low-loss filters and phase shifters

 

 

For projects where signal integrity, loss minimization, and batch-to-batch consistency are non-negotiable, RT/duroid 5870 delivers proven performance. Contact our sales engineering team today to discuss your specific requirements, request samples, or place an order. We are here to provide the technical support and material solutions that ensure your high-frequency design succeeds.

 

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