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TMM4 60mil Core Laminate raw Material built for 2-Layer High-Frequency PCB using in Patch Antennas

TMM4 60mil Core Laminate raw Material built for 2-Layer High-Frequency PCB using in Patch Antennas

MOQ: 1個
価格: 0.99-99USD/PCS
標準パッケージ: パッキング
配達期間: 2〜10営業日
決済方法: T/T、ペイパル
供給能力: 50000個
詳細情報
起源の場所
中国
ブランド名
Rogers
証明
ISO9001
モデル番号
TMM4
最小注文数量:
1個
価格:
0.99-99USD/PCS
パッケージの詳細:
パッキング
受渡し時間:
2〜10営業日
支払条件:
T/T、ペイパル
供給の能力:
50000個
製品説明

2-Layer High-Frequency PCB with TMM4 Core Material

 

 

As a supplier specializing in high-frequency circuit boards, we are proud to offer this robust 2-layer PCB, designed for demanding RF and microwave applications. Built using Rogers TMM4 thermoset microwave material, this PCB combines exceptional electrical performance, strong mechanical properties, and high reliability, making it ideal for advanced communication systems, power amplifiers, and satellite technologies. Below, we detail the construction, material properties, and benefits of this PCB.

 

TMM4 60mil Core Laminate raw Material built for 2-Layer High-Frequency PCB using in Patch Antennas 0

 

PCB Construction Details

Parameter Specification
Base Material Rogers TMM4
Layer Count 2 layers
Board Dimensions 47mm x 118mm ± 0.15mm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) on outer layers
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.35mm
Via Plating Thickness 20μm
Surface Finish Gold over silver plating
Top Solder Mask Green
Bottom Solder Mask None
Top Silkscreen White
Bottom Silkscreen None
Electrical Testing 100% tested
Accepted Standard IPC-Class-2

 

PCB Features and Statistics

This PCB has been optimized for compact yet efficient circuit designs, with the following specifications:

Components: 32

Total Pads: 65 (39 thru-hole pads and 26 SMT pads on the top layer)

Vias: 78

Nets: 2

 

 

About TMM4 Material

The Rogers TMM4 laminate is a high-performance, ceramic-filled thermoset polymer composite specifically developed for high-frequency and microwave applications. Its unique properties make it an excellent alternative to traditional PTFE laminates, offering high reliability and compatibility with standard PCB fabrication processes.

 

 

Key Material Features

  • Dielectric Constant (Dk): 4.50 ± 0.045 (stable over a wide frequency range)
  • Dissipation Factor (Df): 0.0020 at 10GHz, ensuring minimal signal loss
  • Thermal Coefficient of Dk: 15ppm/°K
  • Coefficient of Thermal Expansion (CTE): Matched to copper for improved thermal reliability (16 ppm/°K in x and y axes; 21 ppm/°K in z-axis)
  • Decomposition Temperature (Td): 425°C, providing excellent thermal stability
  • Moisture Absorption: 0.07%–0.18%, ensuring performance in humid environments
  • Thermal Conductivity: 0.7 W/m·K for efficient heat dissipation

 

 

TMM4 laminates are particularly well-suited for wire-bonding applications, resisting pad lifting and substrate deformation. Their mechanical and chemical resistance ensures minimal damage during fabrication and extended product lifespan.

 

 

Benefits of Using TMM4-Based PCBs

 

High-Frequency Performance:
The low Df and stable Dk provide excellent signal integrity, ensuring consistent performance in RF and microwave circuits.

 

Reliability:
TMM4 materials exhibit high mechanical strength, excellent plated-through-hole reliability, and resistance to creep and cold flow, even under extreme conditions.

 

Fabrication Compatibility:
Unlike PTFE laminates, TMM4 does not require specialized processing techniques, making it cost-effective and compatible with standard PWB processes.

 

Durability in Harsh Environments:
The material resists moisture, high temperatures, and harsh chemicals, ensuring long-term stability and reliability.

 

 

Applications

This PCB is ideal for a range of high-frequency applications, including:

  1. RF and Microwave Circuitry
  2. Power Amplifiers and Combiners
  3. Satellite Communication Systems
  4. Global Positioning System (GPS) Antennas
  5. Patch Antennas and Filters
  6. Chip Testers
  7. Dielectric Polarizers and Lenses

 

 

Conclusion

With its Rogers TMM4 core, this 2-layer PCB is engineered to support high-frequency applications that require low signal loss, excellent thermal stability, and high mechanical strength. Its hybrid design and adherence to IPC-Class-2 standards ensure consistent quality and performance, making it the perfect choice for RF and microwave engineers worldwide.

 

製品
商品の詳細
TMM4 60mil Core Laminate raw Material built for 2-Layer High-Frequency PCB using in Patch Antennas
MOQ: 1個
価格: 0.99-99USD/PCS
標準パッケージ: パッキング
配達期間: 2〜10営業日
決済方法: T/T、ペイパル
供給能力: 50000個
詳細情報
起源の場所
中国
ブランド名
Rogers
証明
ISO9001
モデル番号
TMM4
最小注文数量:
1個
価格:
0.99-99USD/PCS
パッケージの詳細:
パッキング
受渡し時間:
2〜10営業日
支払条件:
T/T、ペイパル
供給の能力:
50000個
製品説明

2-Layer High-Frequency PCB with TMM4 Core Material

 

 

As a supplier specializing in high-frequency circuit boards, we are proud to offer this robust 2-layer PCB, designed for demanding RF and microwave applications. Built using Rogers TMM4 thermoset microwave material, this PCB combines exceptional electrical performance, strong mechanical properties, and high reliability, making it ideal for advanced communication systems, power amplifiers, and satellite technologies. Below, we detail the construction, material properties, and benefits of this PCB.

 

TMM4 60mil Core Laminate raw Material built for 2-Layer High-Frequency PCB using in Patch Antennas 0

 

PCB Construction Details

Parameter Specification
Base Material Rogers TMM4
Layer Count 2 layers
Board Dimensions 47mm x 118mm ± 0.15mm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) on outer layers
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.35mm
Via Plating Thickness 20μm
Surface Finish Gold over silver plating
Top Solder Mask Green
Bottom Solder Mask None
Top Silkscreen White
Bottom Silkscreen None
Electrical Testing 100% tested
Accepted Standard IPC-Class-2

 

PCB Features and Statistics

This PCB has been optimized for compact yet efficient circuit designs, with the following specifications:

Components: 32

Total Pads: 65 (39 thru-hole pads and 26 SMT pads on the top layer)

Vias: 78

Nets: 2

 

 

About TMM4 Material

The Rogers TMM4 laminate is a high-performance, ceramic-filled thermoset polymer composite specifically developed for high-frequency and microwave applications. Its unique properties make it an excellent alternative to traditional PTFE laminates, offering high reliability and compatibility with standard PCB fabrication processes.

 

 

Key Material Features

  • Dielectric Constant (Dk): 4.50 ± 0.045 (stable over a wide frequency range)
  • Dissipation Factor (Df): 0.0020 at 10GHz, ensuring minimal signal loss
  • Thermal Coefficient of Dk: 15ppm/°K
  • Coefficient of Thermal Expansion (CTE): Matched to copper for improved thermal reliability (16 ppm/°K in x and y axes; 21 ppm/°K in z-axis)
  • Decomposition Temperature (Td): 425°C, providing excellent thermal stability
  • Moisture Absorption: 0.07%–0.18%, ensuring performance in humid environments
  • Thermal Conductivity: 0.7 W/m·K for efficient heat dissipation

 

 

TMM4 laminates are particularly well-suited for wire-bonding applications, resisting pad lifting and substrate deformation. Their mechanical and chemical resistance ensures minimal damage during fabrication and extended product lifespan.

 

 

Benefits of Using TMM4-Based PCBs

 

High-Frequency Performance:
The low Df and stable Dk provide excellent signal integrity, ensuring consistent performance in RF and microwave circuits.

 

Reliability:
TMM4 materials exhibit high mechanical strength, excellent plated-through-hole reliability, and resistance to creep and cold flow, even under extreme conditions.

 

Fabrication Compatibility:
Unlike PTFE laminates, TMM4 does not require specialized processing techniques, making it cost-effective and compatible with standard PWB processes.

 

Durability in Harsh Environments:
The material resists moisture, high temperatures, and harsh chemicals, ensuring long-term stability and reliability.

 

 

Applications

This PCB is ideal for a range of high-frequency applications, including:

  1. RF and Microwave Circuitry
  2. Power Amplifiers and Combiners
  3. Satellite Communication Systems
  4. Global Positioning System (GPS) Antennas
  5. Patch Antennas and Filters
  6. Chip Testers
  7. Dielectric Polarizers and Lenses

 

 

Conclusion

With its Rogers TMM4 core, this 2-layer PCB is engineered to support high-frequency applications that require low signal loss, excellent thermal stability, and high mechanical strength. Its hybrid design and adherence to IPC-Class-2 standards ensure consistent quality and performance, making it the perfect choice for RF and microwave engineers worldwide.

 

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