|
| MOQ: | 1pcs |
| 価格: | 2.99USD/pcs |
| 標準パッケージ: | パッキング |
| 配達期間: | 2〜10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000pcs |
What circuit boards do we do? (54)
WL-CT338 High Frequency PCB
Introduction
WL-CT series laminates are high-frequency materials that combine hydrocarbon resin, ceramic, and glass fiber cloth in a thermosetting resin system, providing low loss performance and meeting high-frequency design requirements. The combination of hydrocarbon resin and composite ceramics in this series results in low loss, high temperature resistance, temperature stability, stable dielectric constant, low thermal expansion coefficient, and a high TG value exceeding 280℃.
Features
The dielectric constants of these series range from 3.0 to 6.15, with a dissipation factor ranging from 0.003 to 0.005. For instance, WL-CT338 exhibits a DK value of 3.38 and a DF value of 0.0029.
These materials feature a combination of forward rotating ED copper and reverse treated foil (TRF) cladding. The standard options for copper weight include 0.5oz and 1oz, with the possibility of customizing other heavier weights.
TRF copper foil is adhesive-backed, resulting in a 7 mil thicker than that of ED copper substrate. The peel strength for these series is 0.72 N/mm.
The coefficient of thermal expansion (CTE) in the X/Y direction is matched to copper foil, ranging from 11 to 18 ppm/℃. In the Z direction, minimal expansion is observed, ranging from 31 to 50 ppm/℃.
These materials exhibit favorable water absorption rates, ranging from 0.02% to 0.15%. Additionally, they offer high thermal conductivity, ranging from 0.41 to 0.72 W/mK.
PCB Capability (WL-CT338)
We specialize in offering WL-CT338 PCBs with a wide range of capabilities and specifications.
Layer count includes single-sided, double-sided, multilayer, and hybrid PCBs.
Flexible options for finished copper weight, with choices of 1oz and 2oz.
Various dielectric thickness options, depending on the type of copper used. For ED Copper, we offer thicknesses ranging from 4mil to 80mil, and for TRF Copper, thicknesses ranging from 8.7mil to 80.7mil.
Our capability supports PCB sizes up to 400mm X 500mm, providing flexibility for designing your PCB layout.
A wide selection of solder mask colors, including green, black, blue, yellow, red, and more, allowing you to choose the desired color for your PCB.
Different surface finish options to meet your specific requirements. These options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, and ENEPIG.
Applications
WL-CT338 PCBs offer versatility and can be applied in a wide range of applications, including base station antennas, satellite antennas, automotive radar systems, WIMAX antennas, distributed antennas, and miniature patch antennas etc.
Thank you. See you next time.
|
|
| MOQ: | 1pcs |
| 価格: | 2.99USD/pcs |
| 標準パッケージ: | パッキング |
| 配達期間: | 2〜10営業日 |
| 決済方法: | T/T、ペイパル |
| 供給能力: | 50000pcs |
What circuit boards do we do? (54)
WL-CT338 High Frequency PCB
Introduction
WL-CT series laminates are high-frequency materials that combine hydrocarbon resin, ceramic, and glass fiber cloth in a thermosetting resin system, providing low loss performance and meeting high-frequency design requirements. The combination of hydrocarbon resin and composite ceramics in this series results in low loss, high temperature resistance, temperature stability, stable dielectric constant, low thermal expansion coefficient, and a high TG value exceeding 280℃.
Features
The dielectric constants of these series range from 3.0 to 6.15, with a dissipation factor ranging from 0.003 to 0.005. For instance, WL-CT338 exhibits a DK value of 3.38 and a DF value of 0.0029.
These materials feature a combination of forward rotating ED copper and reverse treated foil (TRF) cladding. The standard options for copper weight include 0.5oz and 1oz, with the possibility of customizing other heavier weights.
TRF copper foil is adhesive-backed, resulting in a 7 mil thicker than that of ED copper substrate. The peel strength for these series is 0.72 N/mm.
The coefficient of thermal expansion (CTE) in the X/Y direction is matched to copper foil, ranging from 11 to 18 ppm/℃. In the Z direction, minimal expansion is observed, ranging from 31 to 50 ppm/℃.
These materials exhibit favorable water absorption rates, ranging from 0.02% to 0.15%. Additionally, they offer high thermal conductivity, ranging from 0.41 to 0.72 W/mK.
PCB Capability (WL-CT338)
We specialize in offering WL-CT338 PCBs with a wide range of capabilities and specifications.
Layer count includes single-sided, double-sided, multilayer, and hybrid PCBs.
Flexible options for finished copper weight, with choices of 1oz and 2oz.
Various dielectric thickness options, depending on the type of copper used. For ED Copper, we offer thicknesses ranging from 4mil to 80mil, and for TRF Copper, thicknesses ranging from 8.7mil to 80.7mil.
Our capability supports PCB sizes up to 400mm X 500mm, providing flexibility for designing your PCB layout.
A wide selection of solder mask colors, including green, black, blue, yellow, red, and more, allowing you to choose the desired color for your PCB.
Different surface finish options to meet your specific requirements. These options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, and ENEPIG.
Applications
WL-CT338 PCBs offer versatility and can be applied in a wide range of applications, including base station antennas, satellite antennas, automotive radar systems, WIMAX antennas, distributed antennas, and miniature patch antennas etc.
Thank you. See you next time.
