|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | 梱包 |
| 配達期間: | 2〜10 営業日 |
| 決済方法: | T/T,ペイパール |
| 供給能力: | 50000個 |
What circuit boards do we do? (4)
RO3035 High Frequency PCB
Introduction
Rogers RO3035 laminates are ceramic-filled, PTFE based high frequency circuit materials. These laminates are specifically designed to excel in high-frequency applications and allow designers to develop multi-layer board designs without warping or decreased reliability. One of the key advantages is their expansion coefficient, which is carefully matched to that of copper. This matching ensures exceptional dimensional stability, preventing warping or distortions in the PCBs.
Features:
RO3035 high-frequency material features a dielectric constant (Dk) of 3.50 +/- 0.05, ensuring precise signal transmission and efficient performance. With a dissipation factor of only 0.0015 at 10 GHz, they minimize signal loss and maintain excellent signal integrity.
RO3035 laminates exhibit a low coefficient of thermal expansion (CTE) in the X, Y, and Z axes, measuring 17 ppm/°C, 17 ppm/°C, and 24 ppm/°C, respectively. This dimensional stability enhances the PCBs' reliability and prevents warping or distortions in multi-layer board designs.
Benefits:
RO3035 materials come with several notable benefits that make them an ideal choice for high-frequency applications.
They can be effectively utilized in applications up to 30-40 GHz, offering exceptional performance in demanding frequency ranges.
They exhibit a lower operating temperature, enabling increased reliability, particularly in power amplifier circuits where heat dissipation is crucial.
And lastly, RO3035 laminates are available with rolled copper. The smoother copper surface is contributing to achieving higher signal integrity, lower insertion loss, and better overall performance.
PCB Capabilities
We can provide you with single layer board, double layer board, multi-layer board and hybrid PCBs.
You can choose thickness for 5 mils, 10 mils, 20 mils, 30 mils and 60 mils with one ounce and two ounces.
Dimension within 400mm by 500mm is well suited for manufacture.
We also offer a wide range of colors for solder mask, including green, black, blue, yellow and red etc.
For surface finishes, Immersion gold, immersion silver, immersion tin and HASL, ENEPIG, OSP etc are available for options.
| PCB Material: | Ceramic-filled PTFE Composites |
| Designation: | RO3035 |
| Dielectric constant: | 3.5 |
| Dissipation Factor | 0.0015 10GHz |
| Layer count: | Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersin gold, Immersion silver, Immersion tin, HASL, ENEPIG, OSP, Pure gold plated, Bare copper etc.. |
Applications
RO3035 PCBs find applications in various high-frequency and advanced technology fields. It provides design solutions for 5G, millimeter wave sub 6GHz and massive MiMo applications etc.
Thank you. I’ll see you next time.
|
|
| MOQ: | 1個 |
| 価格: | 0.99-99USD/PCS |
| 標準パッケージ: | 梱包 |
| 配達期間: | 2〜10 営業日 |
| 決済方法: | T/T,ペイパール |
| 供給能力: | 50000個 |
What circuit boards do we do? (4)
RO3035 High Frequency PCB
Introduction
Rogers RO3035 laminates are ceramic-filled, PTFE based high frequency circuit materials. These laminates are specifically designed to excel in high-frequency applications and allow designers to develop multi-layer board designs without warping or decreased reliability. One of the key advantages is their expansion coefficient, which is carefully matched to that of copper. This matching ensures exceptional dimensional stability, preventing warping or distortions in the PCBs.
Features:
RO3035 high-frequency material features a dielectric constant (Dk) of 3.50 +/- 0.05, ensuring precise signal transmission and efficient performance. With a dissipation factor of only 0.0015 at 10 GHz, they minimize signal loss and maintain excellent signal integrity.
RO3035 laminates exhibit a low coefficient of thermal expansion (CTE) in the X, Y, and Z axes, measuring 17 ppm/°C, 17 ppm/°C, and 24 ppm/°C, respectively. This dimensional stability enhances the PCBs' reliability and prevents warping or distortions in multi-layer board designs.
Benefits:
RO3035 materials come with several notable benefits that make them an ideal choice for high-frequency applications.
They can be effectively utilized in applications up to 30-40 GHz, offering exceptional performance in demanding frequency ranges.
They exhibit a lower operating temperature, enabling increased reliability, particularly in power amplifier circuits where heat dissipation is crucial.
And lastly, RO3035 laminates are available with rolled copper. The smoother copper surface is contributing to achieving higher signal integrity, lower insertion loss, and better overall performance.
PCB Capabilities
We can provide you with single layer board, double layer board, multi-layer board and hybrid PCBs.
You can choose thickness for 5 mils, 10 mils, 20 mils, 30 mils and 60 mils with one ounce and two ounces.
Dimension within 400mm by 500mm is well suited for manufacture.
We also offer a wide range of colors for solder mask, including green, black, blue, yellow and red etc.
For surface finishes, Immersion gold, immersion silver, immersion tin and HASL, ENEPIG, OSP etc are available for options.
| PCB Material: | Ceramic-filled PTFE Composites |
| Designation: | RO3035 |
| Dielectric constant: | 3.5 |
| Dissipation Factor | 0.0015 10GHz |
| Layer count: | Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersin gold, Immersion silver, Immersion tin, HASL, ENEPIG, OSP, Pure gold plated, Bare copper etc.. |
Applications
RO3035 PCBs find applications in various high-frequency and advanced technology fields. It provides design solutions for 5G, millimeter wave sub 6GHz and massive MiMo applications etc.
Thank you. I’ll see you next time.
